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參數(shù)資料
| 型號： | AD7793BRU |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 21/33頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ADC 24BIT 3CH LP 16-TSSOP |
| 設(shè)計資源： | Fully Isolated Input Module Based on AD7793 and ADuM5401(CN0066) Fully Isolated Input Module Based on AD7793, ADuM5401, and a High Performance In-Amp (CN0067) |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 位數(shù)： | 24 |
| 采樣率（每秒）： | 500 |
| 數(shù)據(jù)接口： | DSP，MICROWIRE?，QSPI?，串行，SPI? |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 功率耗散（最大）： | 2.5mW |
| 電壓電源： | 模擬和數(shù)字 |
| 工作溫度： | -40°C ~ 105°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 16-TSSOP |
| 包裝： | 管件 |
| 輸入數(shù)目和類型： | 3 個差分，單極；3 個差分，雙極 |
| 配用： | EVAL-AD7793EBZ-ND - BOARD EVALUATION FOR AD7793 |
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AD7792/AD7793
Rev. B | Page 27 of 32
The ground planes of the AD7792/AD7793 should be allowed
to run under the AD7792/AD7793 to prevent noise coupling.
The power supply lines to the AD7792/AD7793 should use as
wide a trace as possible to provide low impedance paths and
reduce the effects of glitches on the power supply line. Fast
switching signals such as clocks should be shielded with digital
ground to avoid radiating noise to other sections of the board,
and clock signals should never be run near the analog inputs.
Avoid crossover of digital and analog signals. Traces on
opposite sides of the board should run at right angles to each
other. This reduces the effects of feedthrough through the
board. A microstrip technique is by far the best, but it is not
always possible with a double-sided board. In this technique,
the component side of the board is dedicated to ground planes,
and signals are placed on the solder side.
Good decoupling is important when using high resolution
ADCs. AVDD should be decoupled with 10 μF tantalum in
parallel with 0.1 μF capacitors to GND. DVDD should be
decoupled with 10 μF tantalum in parallel with 0.1 μF
capacitors to the system’s DGND plane, with the system’s
AGND to DGND connection being close to the
AD7792/AD7793.
To achieve the best from these decoupling components, they
should be placed as close as possible to the device, ideally right
up against the device. All logic chips should be decoupled with
0.1 μF ceramic capacitors to DGND.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AD7793BRU-REEL | 制造商:Analog Devices 功能描述:ADC Single Delta-Sigma 470sps 24-bit Serial 16-Pin TSSOP T/R 制造商:Analog Devices 功能描述:ADC SGL DELTA-SIGMA 0.47KSPS 24BIT SERL 16TSSOP - Tape and Reel |
| AD7793BRUZ | 功能描述:IC ADC 24BIT SIG-DEL 3CH 16TSSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:microPOWER™ 位數(shù):8 采樣率（每秒）:1M 數(shù)據(jù)接口:串行，SPI? 轉(zhuǎn)換器數(shù)目:1 功率耗散（最大）:- 電壓電源:模擬和數(shù)字 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:24-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:24-VQFN 裸露焊盤（4x4） 包裝:Digi-Reel® 輸入數(shù)目和類型:8 個單端，單極 產(chǎn)品目錄頁面:892 (CN2011-ZH PDF) 其它名稱:296-25851-6 |
| AD7793BRUZ1 | 制造商:AD 制造商全稱:Analog Devices 功能描述:3-Channel, Low Noise, Low Power, 16-/24-Bit ?￡-?? ADC with On-Chip In-Amp and Reference |
| AD7793BRUZ-REEL | 功能描述:IC ADC 24BIT 3CH LP 16-TSSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 位數(shù):16 采樣率（每秒）:45k 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:2 功率耗散（最大）:315mW 電壓電源:模擬和數(shù)字 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC W 包裝:帶卷 (TR) 輸入數(shù)目和類型:2 個單端，單極 |
| AD7793BRUZ-REEL1 | 制造商:AD 制造商全稱:Analog Devices 功能描述:3-Channel, Low Noise, Low Power, 16-/24-Bit ?￡-?? ADC with On-Chip In-Amp and Reference |
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