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參數(shù)資料
| 型號： | AD7690BCPZRL |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 16/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ADC 18BIT 400KSPS 10-LFCSP |
| 標準包裝： | 5,000 |
| 系列： | PulSAR® |
| 位數(shù)： | 18 |
| 采樣率（每秒）： | 400k |
| 數(shù)據(jù)接口： | DSP，MICROWIRE?，QSPI?，串行，SPI? |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 功率耗散（最大）： | 20mW |
| 電壓電源： | 模擬和數(shù)字 |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 10-WFDFN 裸露焊盤，CSP |
| 供應(yīng)商設(shè)備封裝： | 10-LFCSP-WD（3x3） |
| 包裝： | 帶卷 (TR) |
| 輸入數(shù)目和類型： | 1 個差分，雙極 |
AD7690
Rev. B | Page 23 of 24
APPLICATION HINTS
LAYOUT
The printed circuit board that houses the AD7690 should be
designed so that the analog and digital sections are separated
and confined to certain areas of the board. The pinout of the
AD7690, with its analog signals on the left side and its digital
signals on the right side, eases this task.
Avoid running digital lines under the device because these
couple noise onto the die unless a ground plane under the
AD7690 is used as a shield. Fast switching signals, such as CNV
or clocks, should not run near analog signal paths. Crossover of
digital and analog signals should be avoided.
At least one ground plane should be used. It can be common or
split between the digital and analog sections. In the latter case,
the planes should be joined underneath the AD7690s.
The AD7690 voltage reference input REF has a dynamic input
impedance and should be decoupled with minimal parasitic
inductances. This is done by placing the reference decoupling
ceramic capacitor close to, ideally right up against, the REF and
GND pins and connecting them with wide, low impedance traces.
Finally, the AD7690 VDD and VIO power supplies should be
decoupled with ceramic capacitors, typically 100 nF, placed
close to the AD7690 and connected using short, wide traces to
provide low impedance paths and to reduce the effect of glitches
on the power supply lines.
An example of a layout following these rules is shown in
Figure 46 and Figure 47.
EVALUATING THE AD7690’S PERFORMANCE
Other recommended layouts for the AD7690 are outlined
in the documentation of the evaluation board (EVAL-
AD7690CBZ). The evaluation board package includes
a fully assembled and tested evaluation board, documentation,
and software for controlling the board from a PC via the
0
57
92
-0
23
Figure 46. Example Layout of the AD7690 (Top Layer)
05
79
2-
0
24
Figure 47. Example Layout of the AD7690 (Bottom Layer)
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| AD7690BCPZRL7 | 功能描述:IC ADC 18BIT 400KSPS 10-LFCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:PulSAR® 其它有關(guān)文件:TSA1204 View All Specifications 標準包裝:1 系列:- 位數(shù):12 采樣率（每秒）:20M 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:2 功率耗散（最大）:155mW 電壓電源:模擬和數(shù)字 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:48-TQFP 供應(yīng)商設(shè)備封裝:48-TQFP（7x7） 包裝:Digi-Reel® 輸入數(shù)目和類型:4 個單端，單極；2 個差分，單極 產(chǎn)品目錄頁面:1156 (CN2011-ZH PDF) 其它名稱:497-5435-6 |
| AD7690BRMZ | 功能描述:IC ADC 18BIT 400KSPS 10MSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:PulSAR® 標準包裝:1 系列:microPOWER™ 位數(shù):8 采樣率（每秒）:1M 數(shù)據(jù)接口:串行，SPI? 轉(zhuǎn)換器數(shù)目:1 功率耗散（最大）:- 電壓電源:模擬和數(shù)字 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:24-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:24-VQFN 裸露焊盤（4x4） 包裝:Digi-Reel® 輸入數(shù)目和類型:8 個單端，單極 產(chǎn)品目錄頁面:892 (CN2011-ZH PDF) 其它名稱:296-25851-6 |
| AD7690BRMZ-RL7 | 功能描述:IC ADC 18BIT 400KSPS 10-MSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:PulSAR® 標準包裝:1 系列:- 位數(shù):14 采樣率（每秒）:83k 數(shù)據(jù)接口:串行，并聯(lián) 轉(zhuǎn)換器數(shù)目:1 功率耗散（最大）:95mW 電壓電源:雙 ± 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:28-DIP（0.600"，15.24mm） 供應(yīng)商設(shè)備封裝:28-PDIP 包裝:管件 輸入數(shù)目和類型:1 個單端，雙極 |
| AD7690BRNZ | 制造商:Analog Devices 功能描述: |
| AD7691 | 制造商:AD 制造商全稱:Analog Devices 功能描述:16-Bit Lower Power |
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