TA = 25°C, unless o" />
參數(shù)資料
型號: AD7477ARTZ-500RL7
廠商: Analog Devices Inc
文件頁數(shù): 2/25頁
文件大?。?/td> 0K
描述: IC ADC 10BIT 1MSPS SOT23-6
標(biāo)準(zhǔn)包裝: 1
位數(shù): 10
采樣率(每秒): 1M
數(shù)據(jù)接口: DSP,MICROWIRE?,QSPI?,串行,SPI?
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 17.5mW
電壓電源: 單電源
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: SOT-23-6
供應(yīng)商設(shè)備封裝: SOT-23-6
包裝: 標(biāo)準(zhǔn)包裝
輸入數(shù)目和類型: 1 個單端,單極
產(chǎn)品目錄頁面: 778 (CN2011-ZH PDF)
配用: EVAL-AD7477CBZ-ND - BOARD EVALUATION FOR AD7477
其它名稱: AD7477ARTZ500RLDKR
AD7476/AD7477/AD7478
Rev. F | Page 9 of 24
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 5.
Parameter
Rating
VDD to GND
0.3 V to +7 V
Analog Input Voltage to GND
0.3 V to VDD + 0.3 V
Digital Input Voltage to GND
0.3 V to +7 V
Digital Output Voltage to GND
0.3 V to VDD + 0.3 V
±10 mA
Operating Temperature Range
Commercial Range (A, B Versions)
–40°C to +85°C
Military Range (S Version)
55°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
SOT-23 Package
θJA Thermal Impedance
230°C/W
θJC Thermal Impedance
92°C/W
Lead Temperature, Soldering Reflow
(10 sec to 30 sec)
235 (0/+5)°C
Pb-free Temperature Soldering Reflow
255 (0/+5)°C
ESD
3.5 kV
1Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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