參數(shù)資料
型號: AD7450BRMZ
廠商: Analog Devices Inc
文件頁數(shù): 18/22頁
文件大?。?/td> 0K
描述: IC ADC 12BIT DIFF IN 1MSPS 8MSOP
標(biāo)準(zhǔn)包裝: 50
位數(shù): 12
采樣率(每秒): 1M
數(shù)據(jù)接口: DSP,MICROWIRE?,QSPI?,串行,SPI?
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 9.25mW
電壓電源: 單電源
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 8-MSOP
包裝: 管件
輸入數(shù)目和類型: 1 個差分,單極
配用: EVAL-AD7450CBZ-ND - BOARD EVALUATION FOR AD7450
AD7450
–5–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD7450 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to
avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1
(TA = 25
°C, unless otherwise noted.)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VIN+ to GND . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
VIN– to GND . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Digital Input Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V
Digital Output Voltage to GND . . . . . –0.3 V to VDD + 0.3 V
VREF to GND . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Input Current to Any Pin Except Supplies
2
. . . . . . .
±10 mA
Operating Temperature Range
Commercial (A and B Version) . . . . . . . . . –40
oC to +85oC
Storage Temperature Range . . . . . . . . . . . . –65
oC to +150oC
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
oC
SOIC,
SOIC Package, Power Dissipation . . . . . . . . 450 mW
JA Thermal Impedance . . . . . . . . . . . . . . . .
157
°C/W (SOIC)
. . . . . . . . . . . . . . . . . . . . . . . . . . . 205.9
°C/W (SOIC)
JC Thermal Impedance . . . . . . . . . . . . . . . . .
56
°C/W (SOIC)
. . . . . . . . . . . . . . . . . . . . . . . . . . . 43.74
°C/W (SOIC)
Lead Temperature, Soldering
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . . . 215
oC
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
oC
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 kV
NOTES
1Stresses above those listed under the Absolute Maximum Ratings may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2Transient currents of up to 100 mA will not cause SCR latch up.
TO
OUTPUT
PIN
CL
50pF
1.6V
200 A
IOL
200 A
IOH
Figure 2. Load Circuit for Digital Output Timing
Specifications
Rev. A
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