參數(shù)資料
型號: AD7396AR-REEL
廠商: Analog Devices Inc
文件頁數(shù): 8/12頁
文件大?。?/td> 0K
描述: IC DAC 12BIT PARALLEL 3V 24-SOIC
產(chǎn)品培訓模塊: Data Converter Fundamentals
DAC Architectures
標準包裝: 1,000
設置時間: 60µs
位數(shù): 12
數(shù)據(jù)接口: 并聯(lián)
轉換器數(shù)目: 2
電壓電源: 單電源
功率耗散(最大): 1mW
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 24-SOIC(0.295",7.50mm 寬)
供應商設備封裝: 24-SOIC W
包裝: 帶卷 (TR)
輸出數(shù)目和類型: 2 電壓,單極;2 電壓,雙極
采樣率(每秒): 17k
AD7396/AD7397
–5–
REV. 0
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7396/AD7397 features proprietary ESD protection circuitry, permanent dam-
age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS*
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V
VREF to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD
Logic Inputs to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V
VOUT to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +2 V
IOUT Short Circuit to GND . . . . . . . . . . . . . . . . . . . . +50 mA
Package Power Dissipation . . . . . . . . . . . . . (TJ max – TA)/
θ
JA
Thermal Resistance
θ
JA
24-Lead Plastic DIP Package (N-24) . . . . . . . . . . +63
°C/W
24-Lead SOIC Package (R-24) . . . . . . . . . . . . . . . +70
°C/W
24-Lead Thin Shrink Surface Mount (RU-24) . . +143
°C/W
ORDERING GUIDE
Res
Temperature
Package
Model
(LSB)
Ranges
Descriptions
Options
AD7396AN
12
–40
°C to +85°C
24-Lead P-DIP
N-24
AD7396AR
12
–40
°C to +85°C
24-Lead SOIC
R-24
AD7397AN
10
–40
°C to +125°C
24-Lead P-DIP
N-24
AD7397AR
10
–40
°C to +125°C
24-Lead SOIC
R-24
AD7397ARU
10
–40
°C to +85°C
24-Lead Thin Shrink Small Outline Package (TSSOP)
RU-24
The AD7396/AD7397 contains 1365 transistors. The die size measures 89 mil
× 106 mil = 9434 sq mil.
Maximum Junction Temperature (TJ max) . . . . . . . . . +150
°C
Operating Temperature Range . . . . . . . . . . . –40
°C to +85°C
AD7397AN, AD7397AR Only . . . . . . . . –40
°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature
N-24 (Soldering, 10 sec) . . . . . . . . . . . . . . . . . . . . . . +300
°C
R-24 (Vapor Phase, 60 sec) . . . . . . . . . . . . . . . . . . . . +215
°C
RU-24 (Infrared, 15 sec) . . . . . . . . . . . . . . . . . . . . . . +224
°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
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