TA = 25°C, unless otherwise noted" />
參數(shù)資料
型號: AD7195BCPZ
廠商: Analog Devices Inc
文件頁數(shù): 45/45頁
文件大小: 0K
描述: IC AFE 24BIT 4.8K 32LFSP
設(shè)計資源: Precision Weigh Scale Design Using AD7195 with Internal PGA and AC Excitation (CN0155)
標準包裝: 1
位數(shù): 24
通道數(shù): 4
電壓 - 電源,模擬: 4.75 V ~ 5.25 V
電壓 - 電源,數(shù)字: 2.7 V ~ 5.25 V
封裝/外殼: 32-WFQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 32-LFCSP-WQ(5x5)
包裝: 托盤
AD7195
Rev. 0 | Page 8 of 44
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
AVDD to AGND
0.3 V to +6.5 V
DVDD to AGND
0.3 V to +6.5 V
AGND to DGND
0.3 V to +0.3 V
Analog Input Voltage to AGND
0.3 V to AVDD + 0.3 V
Reference Input Voltage to AGND
0.3 V to AVDD + 0.3 V
Digital Input Voltage to DGND
0.3 V to DVDD + 0.3 V
Digital Output Voltage to DGND
0.3 V to DVDD + 0.3 V
AIN/Digital Input Current
10 mA
Operating Temperature Range
40°C to +105°C
Storage Temperature Range
65°C to +150°C
Maximum Junction Temperature
150°C
Lead Temperature, Soldering
Reflow
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
32-Lead LFCSP_WQ
32.5
32.71
°C/W
ESD CAUTION
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