參數資料
| 型號： | AD5623RBRMZ-3 |
| 廠商： | Analog Devices Inc |
| 文件頁數： | 20/32頁 |
| 文件大小： | 0K |
| 描述： | IC DAC NANO 12BIT DUAL 10-MSOP |
| 產品培訓模塊： | Data Converter Fundamentals DAC Architectures |
| 標準包裝： | 50 |
| 系列： | nanoDAC™ |
| 設置時間： | 3µs |
| 位數： | 12 |
| 數據接口： | 串行 |
| 轉換器數目： | 2 |
| 電壓電源： | 單電源 |
| 功率耗散（最大）： | 5mW |
| 工作溫度： | -40°C ~ 105°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 10-TFSOP，10-MSOP（0.118"，3.00mm 寬） |
| 供應商設備封裝： | 10-MSOP |
| 包裝： | 管件 |
| 輸出數目和類型： | 2 電壓，單極；2 電壓，雙極 |
| 采樣率（每秒）： | 287k |
| 產品目錄頁面： | 783 (CN2011-ZH PDF) |
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Data Sheet
AD5623R/AD5643R/AD5663R
Rev. E | Page 27 of 32
POWER SUPPLY BYPASSING AND GROUNDING
When accuracy is important in a circuit, it is helpful to carefully
consider the power supply and ground return layout on the
board. The printed circuit board containing the AD5663R
should have separate analog and digital sections, each having its
own area of the board.
If the AD5663R is in a system where other devices require an
AGND-to-DGND connection, the connection should be made at
one point only. This ground point should be as close as possible
to the AD5663R.
The power supply to the AD5663R should be bypassed with
10 F and 0.1 F capacitors. The capacitors should be located as
close as possible to the device, with the 0.1 F capacitor ideally
right up against the device. The 10 F capacitors are the
tantalum bead type. It is important that the 0.1 F capacitor
have low effective series resistance (ESR) and effective series
inductance (ESI), which is found, for example, in common
ceramic types of capacitors.
This 0.1 F capacitor provides a low impedance path to ground
for high frequencies caused by transient currents due to internal
logic switching.
The power supply line itself should have as large a trace as
possible to provide a low impedance path and to reduce glitch
effects on the supply line. Clocks and other fast switching
digital signals should be shielded from other parts of the board
by digital ground. Avoid crossover of digital and analog signals,
if possible. When traces cross on opposite sides of the board,
ensure that they run at right angles to each other to reduce
feedthrough effects through the board. The best board layout
technique is the microstrip technique, where the component
side of the board is dedicated to the ground plane only and the
signal traces are placed on the solder side. However, this is not
always possible with a 2-layer board.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| AD5623RBRMZ-3REEL7 | 功能描述:IC DAC NANO 12BIT DUAL 10-MSOP RoHS:是 類別:集成電路 (IC) >> 數據采集 - 數模轉換器 系列:nanoDAC™ 產品培訓模塊:LTC263x 12-, 10-, and 8-Bit VOUT DAC Family 特色產品:LTC2636 - Octal 12-/10-/8-Bit SPI VOUT DACs with 10ppm/°C Reference 標準包裝:91 系列:- 設置時間:4µs 位數:10 數據接口:MICROWIRE?，串行，SPI? 轉換器數目:8 電壓電源:單電源 功率耗散（最大）:2.7mW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-WFDFN 裸露焊盤 供應商設備封裝:14-DFN-EP（4x3） 包裝:管件 輸出數目和類型:8 電壓，單極 采樣率（每秒）:* |
| AD5623RBRMZ-5 | 功能描述:IC DAC NANO 12BIT DUAL 10-MSOP RoHS:是 類別:集成電路 (IC) >> 數據采集 - 數模轉換器 系列:nanoDAC™ 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:50 系列:- 設置時間:4µs 位數:12 數據接口:串行 轉換器數目:2 電壓電源:單電源 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應商設備封裝:8-uMAX 包裝:管件 輸出數目和類型:2 電壓，單極 采樣率（每秒）:* 產品目錄頁面:1398 (CN2011-ZH PDF) |
| AD5623RBRMZ-5REEL7 | 功能描述:IC DAC NANO 12BIT DUAL 10-MSOP RoHS:是 類別:集成電路 (IC) >> 數據采集 - 數模轉換器 系列:nanoDAC™ 產品培訓模塊:LTC263x 12-, 10-, and 8-Bit VOUT DAC Family 特色產品:LTC2636 - Octal 12-/10-/8-Bit SPI VOUT DACs with 10ppm/°C Reference 標準包裝:91 系列:- 設置時間:4µs 位數:10 數據接口:MICROWIRE?，串行，SPI? 轉換器數目:8 電壓電源:單電源 功率耗散（最大）:2.7mW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-WFDFN 裸露焊盤 供應商設備封裝:14-DFN-EP（4x3） 包裝:管件 輸出數目和類型:8 電壓，單極 采樣率（每秒）:* |
| AD5624 | 制造商:AD 制造商全稱:Analog Devices 功能描述:2.7 V to 5.5 V, 450 レA, Rail-to-Rail Output, Quad, 12-/16-Bit nanoDACs |
| AD5624BCPZ-250RL7 | 制造商:AD 制造商全稱:Analog Devices 功能描述:2.7 V to 5.5 V, 450 レA, Rail-to-Rail Output, Quad, 12-/16-Bit nanoDACs |
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