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參數(shù)資料
| 型號(hào)： | AD5398BCPZ-REEL |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 6/17頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DAC 10BIT CURRENT-SINK 8LFCSP |
| 產(chǎn)品培訓(xùn)模塊： | Data Converter Fundamentals DAC Architectures |
| 標(biāo)準(zhǔn)包裝： | 5,000 |
| 設(shè)置時(shí)間： | 250µs |
| 位數(shù)： | 10 |
| 數(shù)據(jù)接口： | I²C，串行 |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 電壓電源： | 單電源 |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-VFDFN 裸露焊盤，CSP |
| 供應(yīng)商設(shè)備封裝： | 8-LFCSP-VD（3x3） |
| 包裝： | 帶卷 (TR) |
| 輸出數(shù)目和類型： | 1 電流，單極 |
| 采樣率（每秒）： | 31k |
AD5398
Rev. B | Page 13 of 16
As the current increases through the voice coil, VC increases
and VDROP decreases and eventually approaches the minimum
specified compliance voltage of 600 mV. The ground return
path is modelled by the components RG and LG. The track
resistance between the voice coil and the AD5398 is modelled as
RT. The inductive effects of LG influence RSENSE and RC equally,
and because the current is maintained as a constant, it is not as
critical as the purely resistive component of the ground return
path. When the maximum sink current is flowing through the
motor, the resistive elements, RT and RG, might have an impact
on the voltage headroom of Q1 and could, in turn, limit the
maximum value of RC because of voltage compliance.
For example:
VBAT = 3.6 V
RG = 0.5 Ω
RT = 0.5 Ω
ISINK = 120 mA
VDROP = 600 mV (the compliance voltage)
Then the largest value of resistance of the voice coil, RC, is
=
×
+
×
+
=
SINK
G
SINK
T
SINK
DROP
BAT
C
I
R
I
R
I
V
R
)]
(
)
(
[
Ω
24
mA
120
Ω)]
0.5
mA
(120
2
mV
[600
V
3.6
=
×
+
For this reason it is important to minimize any series impedance
on both the ground return path and interconnect between the
AD5398 and the motor.
The power supply of the AD5398 should be decoupled with
0.1 μF and 10 μF capacitors. These capacitors should be kept as
physically close as possible, with the 0.1 μF capacitor serving as
a local bypass capacitor, and therefore should be located as close
as possible to the VDD pin. The 10 μF capacitor should be a
tantalum bead-type; the 0.1 μF capacitor should be a ceramic
type with a low effective series resistance and effective series
inductance. The 0.1 μF capacitor provides a low impedance path
to ground for high transient currents.
The power supply line should have as large a trace as possible to
provide a low impedance path and reduce glitch effects on the
supply line. Clocks and other fast switching digital signals
should be shielded from other parts of the board by digital
ground. Avoid crossover of digital and analog signals if possible.
When traces cross on opposite sides of the board, ensure that
they run at right angles to each other to reduce feedthrough
effects through the board. The best board layout technique is to
use a multilayer board with ground and power planes, where
the component side of the board is dedicated to the ground
plane only and the signal traces are placed on the solder side.
However, this is not always possible with a 2-layer board.
The exposed paddle on the AD5398 should be soldered to
ground to ensure the best possible thermal performance. The
thermal impedance of the AD5398 LFCSP package is 48°C/W
when soldered in a 4-layer board. It is defined in the Absolute
Maximum Ratings section.
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| AD5398BCPZ-REEL7 | 功能描述:IC DAC 10BIT CURRENT-SINK 8LFCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:50 系列:- 設(shè)置時(shí)間:4µs 位數(shù):12 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:2 電壓電源:單電源 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應(yīng)商設(shè)備封裝:8-uMAX 包裝:管件 輸出數(shù)目和類型:2 電壓，單極 采樣率（每秒）:* 產(chǎn)品目錄頁面:1398 (CN2011-ZH PDF) |
| AD5398BCPZ-WP | 制造商:Analog Devices 功能描述:DAC 1-CH 10-bit 8-Pin LFCSP EP 制造商:Analog Devices 功能描述:10BIT DAC SINGLE SMD 5398 LFCSP8 |
| AD5398BCSURF | 制造商:Rochester Electronics LLC 功能描述: 制造商:Analog Devices 功能描述: |
| AD5398BCSURFZ | 功能描述:IC DAC 10BIT CURR-SINK 9WLCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時(shí)間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
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