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參數(shù)資料
| 型號(hào)： | AC74 |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 通用總線功能 |
| 英文描述： | DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH CLEAR AND PRESET |
| 中文描述： | 雙上升沿觸發(fā)的，有清除和預(yù)設(shè)功能的D型觸發(fā)器 |
| 文件頁數(shù)： | 8/17頁 |
| 文件大?。?/td> | 531K |
| 代理商： | AC74 |
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
Addendum-Page 2
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AC74/D WEE3024C WAF | 制造商:Texas Instruments 功能描述: |
| AC74/D WEF3024C DIE | 制造商:Texas Instruments 功能描述: |
| AC74/D WEG3027C DIE | 制造商:Texas Instruments 功能描述: |
| AC74/D WEG3027C WAF | 制造商:Texas Instruments 功能描述: |
| AC74DIE2V | 制造商:STMicroelectronics 功能描述:QML-V FLIGHT - Gel-pak, waffle pack, wafer, diced wafer on film 制造商:STMicroelectronics 功能描述:DUAL D-TYPE FF + PRESET+CLEAR - Gel-pak, waffle pack, wafer, diced wafer on film |
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