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參數(shù)資料
| 型號： | AA022N1-00 |
| 廠商： | SKYWORKS SOLUTIONS INC |
| 元件分類： | 放大器 |
| 英文描述： | 21000 MHz - 24000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | DIE |
| 文件頁數(shù)： | 1/3頁 |
| 文件大?。?/td> | 135K |
| 代理商： | AA022N1-00 |
Skyworks Solutions, Inc. [978] 241-7000
Fax [978] 241-7906 Email sales@skyworksinc.com www.skyworksinc.com
1
Specifications subject to change without notice. 011/02A
21–24 GHz GaAs MMIC
Low Noise Amplifier
Features
■ Single Bias Supply Operation (4.5 V)
■ 2.6 dB Typical Noise Figure at 23 GHz
■ 19 dB Typical Small Signal Gain
■ 0.25 m Ti/Pd/Au Gates
■ 100% On-Wafer RF, DC and Noise
Figure Testing
■ 100% Visual Inspection to MIL-STD-883
MT 2010
Chip Outline
AA022N1-00
Description
Skyworks’ three-stage reactively-matched 21–24 GHz
MMIC low noise amplifier has typical small signal gain of
19 dB with a typical noise figure of 2.6 dB at 23 GHz.
The chip uses Skyworks’ proven 0.25
m low noise
PHEMT technology, and is based upon MBE layers and
electron beam lithography for the highest uniformity and
repeatability. The FETs employ surface passivation to
ensure a rugged reliable part with through-substrate via
holes and gold-based backside metallization to facilitate
a conductive epoxy die attach process.
Parameter
Condition
Symbol
Min.
Typ.3
Max.
Unit
Drain Current
IDS
35
50
mA
Small Signal Gain
F = 21–24 GHz
G
16
19
dB
Noise Figure
F = 23 GHz
NF
2.6
2.8
dB
Input Return Loss
F = 21–24 GHz
RLI
-7
-6
dB
Output Return Loss
F = 21–24 GHz
RLO
-14
-10
dB
Output Power at 1 dB Gain Compression1
F = 23 GHz
P1 dB
8
dBm
Two-Tone Output Third-Order Intercept1
F = 23 GHz
OIP3
17.5
dBm
Thermal Resistance2
ΘJC
92
°C/W
Electrical Specifications at 25°C (VDS = 4.5 V)
1. Not measured on a 100% basis.
2. Calculated value based on measurement of discrete FET.
3. Typical represents the median parameter value across the specified
frequency range for the median chip.
0.000
1.056
2.355
0.087
0.124
0.235
1.957
2.268
0.493
1.250
1.172
1.162
1.084
1.605
1.829
2.091
2.245
Dimensions indicated in mm.
All DC (V) pads are 0.1 x 0.1 mm and RF In, Out pads are 0.07 mm wide.
Chip thickness = 0.1 mm.
Characteristic
Value
Operating Temperature (TC)
-55°C to +90°C
Storage Temperature (TST)
-65°C to +150°C
Bias Voltage (VD)6 VDC
Power In (PIN)
10 dBm
Junction Temperature (TJ)
175°C
Absolute Maximum Ratings
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