Table 2-8 AC Specifications (5 V PCI Operation) Symbol Parameter Condition Min. Max. Units I
參數(shù)資料
型號: A54SX32A-2TQG176
廠商: Microsemi SoC
文件頁數(shù): 26/108頁
文件大?。?/td> 0K
描述: IC FPGA SX 48K GATES 176-TQFP
標(biāo)準(zhǔn)包裝: 40
系列: SX-A
LAB/CLB數(shù): 2880
輸入/輸出數(shù): 147
門數(shù): 48000
電源電壓: 2.25 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 176-LQFP
供應(yīng)商設(shè)備封裝: 176-TQFP(24x24)
SX-A Family FPGAs
2- 4
v5.3
Table 2-8 AC Specifications (5 V PCI Operation)
Symbol
Parameter
Condition
Min.
Max.
Units
IOH(AC)
Switching Current High
0 < VOUT ≤ 1.4
1
–44
mA
1.4
≤ V
OUT < 2.4
1, 2
(–44 + (VOUT – 1.4)/0.024)
mA
3.1 < VOUT < VCCI
1, 3
(Test Point)
VOUT = 3.1
3
––142
mA
IOL(AC)
Switching Current Low
VOUT ≥ 2.2
1
95
mA
2.2 > VOUT > 0.55
1
(VOUT/0.023)
mA
0.71 > VOUT > 0
1, 3
(Test Point)
VOUT = 0.71
3
206
mA
ICL
Low Clamp Current
–5 < VIN ≤ –1
–25 + (VIN + 1)/0.015
mA
slewR
Output Rise Slew Rate
0.4 V to 2.4 V load 4
15
V/ns
slewF
Output Fall Slew Rate
2.4 V to 0.4 V load 4
15
V/ns
Notes:
1. Refer to the V/I curves in Figure 2-1 on page 2-5. Switching current characteristics for REQ# and GNT# are permitted to be one half
of that specified here; i.e., half size output drivers may be used on these signals. This specification does not apply to CLK and RST#,
which are system outputs. “Switching Current High” specifications are not relevant to SERR#, INTA#, INTB#, INTC#, and INTD#,
which are open drain outputs.
2. Note that this segment of the minimum current curve is drawn from the AC drive point directly to the DC drive point rather than
toward the voltage rail (as is done in the pull-down curve). This difference is intended to allow for an optional N-channel pull-up.
3. Maximum current requirements must be met as drivers pull beyond the last step voltage. Equations defining these maximums (A
and B) are provided with the respective diagrams in Figure 2-1 on page 2-5. The equation defined maximum should be met by
design. In order to facilitate component testing, a maximum current test point is defined for each side of the output driver.
4. This parameter is to be interpreted as the cumulative edge rate across the specified range, rather than the instantaneous rate at any
point within the transition range. The specified load (diagram below) is optional; i.e., the designer may elect to meet this parameter
with an unloaded output per revision 2.0 of the PCI Local Bus Specification. However, adherence to both maximum and minimum
parameters is now required (the maximum is no longer simply a guideline). Since adherence to the maximum slew rate was not
required prior to revision 2.1 of the specification, there may be components in the market for some time that have faster edge
rates; therefore, motherboard designers must bear in mind that rise and fall times faster than this specification could occur and
should ensure that signal integrity modeling accounts for this. Rise slew rate does not apply to open drain outputs.
Output
Buffer
1/2 in. max.
50 pF
Pin
相關(guān)PDF資料
PDF描述
A54SX32A-1TQ176I IC FPGA SX 48K GATES 176-TQFP
979-015-030R121 BACKSHELL DB15 DIE CAST ZINC
972-037-01SR031 BACKSHELL DB37 CLAM SLIM GREY
972-037-01SR011 BACKSHELL DB37 CLAM SLIM BLACK
FMC15DRAN-S734 CONN EDGECARD 30POS .100 R/A SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A54SX32A-2TQG176I 功能描述:IC FPGA SX 48K GATES 176-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX-A 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
A54SX32A-BG329 功能描述:IC FPGA SX 48K GATES 329-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX-A 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
A54SX32A-BG329I 功能描述:IC FPGA SX 48K GATES 329-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX-A 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
A54SX32A-BG329M 制造商:Microsemi Corporation 功能描述:FPGA SX-A Family 32K Gates 1800 Cells 238MHz 0.25um Technology 2.5V 329-Pin BGA 制造商:Microsemi Corporation 功能描述:FPGA SX-A 32K GATES 1800 CELLS 238MHZ 0.25UM/0.22UM 2.5V 329 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 48K GATES 329PBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 249 I/O 329PBGA
A54SX32A-BG329PI85 制造商:Microsemi Corporation 功能描述:FPGA SX-A 32K GATES 1800 CELLS 238MHZ 0.25UM/0.22UM 2.5V 329 - Trays