EQ 2-14 where: EQ 2-15 A heat sink wi" />
參數(shù)資料
型號: A54SX32A-2PQ208
廠商: Microsemi SoC
文件頁數(shù): 36/108頁
文件大?。?/td> 0K
描述: IC FPGA SX 48K GATES 208-PQFP
標(biāo)準(zhǔn)包裝: 24
系列: SX-A
LAB/CLB數(shù): 2880
輸入/輸出數(shù): 174
門數(shù): 48000
電源電壓: 2.25 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 208-BFQFP
供應(yīng)商設(shè)備封裝: 208-PQFP(28x28)
SX-A Family FPGAs
v5.3
2-13
To determine the heat sink's thermal performance, use the following equation:
EQ 2-14
where:
EQ 2-15
A heat sink with a thermal resistance of 9.76°C/W or better should be used. Thermal resistance of heat sinks is a
function of airflow. The heat sink performance can be significantly improved with the presence of airflow.
Carefully estimating thermal resistance is important in the long-term reliability of an Actel FPGA. Design engineers
should always correlate the power consumption of the device with the maximum allowable power dissipation of the
package selected for that device, using the provided thermal resistance data.
Note: The values may vary depending on the application.
θ
JA(TOTAL)
θ
JC
θ
CS
θ
SA
++
=
θ
CS =
0.37°C/W
=
thermal resistance of the interface material between the case and the heat
sink, usually provided by the thermal interface manufacturer
θ
SA =
thermal resistance of the heat sink in °C/W
θ
SA
θ
JA(TOTAL)
θ
JC
θ
CS
=
θ
SA
13.33
°C/W 3.20°C/W
0.37
°C/W
=
θ
SA
9.76
°C/W
=
相關(guān)PDF資料
PDF描述
A54SX32A-2PQG208 IC FPGA SX 48K GATES 208-PQFP
AMM28DSES-S243 CONN EDGECARD 56POS .156 EYELET
978-025-020R121 BACKSHELL DB25 METALIZED PLASTIC
957-925-020R121 BACKSHELL GENDER CHANGE 9-25POS
957-015-020R121 BACKSHELL GENDER CHANGE 15-15POS
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