Junction-to-ambient thermal resistance (θJA
參數(shù)資料
型號(hào)： A54SX08A-2PQ208
廠(chǎng)商： Microsemi SoC
文件頁(yè)數(shù)： 35/108頁(yè)
文件大小： 0K
描述： IC FPGA SX 12K GATES 208-PQFP
標(biāo)準(zhǔn)包裝： 24
系列： SX-A
LAB/CLB數(shù)： 768
輸入/輸出數(shù)： 130
門(mén)數(shù)： 12000
電源電壓： 2.25 V ~ 5.25 V
安裝類(lèi)型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 208-BFQFP
供應(yīng)商設(shè)備封裝： 208-PQFP（28x28）
SX-A Family FPGAs
2- 12
v5.3
Theta-JA
Junction-to-ambient thermal resistance (θJA) is determined under standard conditions specified by JESD-51 series but
has little relevance in actual performance of the product in real application. It should be employed with caution but is
useful for comparing the thermal performance of one package to another.
A sample calculation to estimate the absolute maximum power dissipation allowed (worst case) for a 329-pin PBGA
package at still air is as follows. i.e.:
EQ 2-11
The device's power consumption must be lower than the calculated maximum power dissipation by the package.
The power consumption of a device can be calculated using the Actel power calculator. If the power consumption is
higher than the device's maximum allowable power dissipation, then a heat sink can be attached on top of the case or
the airflow inside the system must be increased.
Theta-JC
Junction-to-case thermal resistance (θJC) measures the ability of a device to dissipate heat from the surface of the chip
to the top or bottom surface of the package. It is applicable for packages used with external heat sinks and only
applies to situations where all or nearly all of the heat is dissipated through the surface in consideration. If the power
consumption is higher than the calculated maximum power dissipation of the package, then a heat sink is required.
Calculation for Heat Sink
For example, in a design implemented in a FG484 package, the power consumption value using the power calculator is
3.00 W. The user-dependent data TJ and TA are given as follows:
From the datasheet:
EQ 2-12
The 2.22 W power is less than then required 3.00 W; therefore, the design requires a heat sink or the airflow where the
device is mounted should be increased. The design's junction-to-air thermal resistance requirement can be estimated
by:
EQ 2-13
θ
JA
= 17.1°C/W is taken from Table 2-12 on page 2-11
TA
= 125°C is the maximum limit of ambient (from the datasheet)
Max. Allowed Power
Max Junction Temp
Max. Ambient Temp
–
θ
JA
------------------------------------------------------------------------------------------------------------
150
°C 125°C
–
17.1
°C/W
----------------------------------------
1.46 W
==
=
TJ = 110°C
TA = 70°C
θ
JA = 18.0°C/W
θ
JC = 3.2 °C/W
P
Max Junction Temp
Max. Ambient Temp
–
θ
JA
------------------------------------------------------------------------------------------------------------
110
°C70°C
–
18.0
°C/W
------------------------------------
2.22 W
==
=
θ
JA
Max Junction Temp
Max. Ambient Temp
–
P
------------------------------------------------------------------------------------------------------------
110
°C70°C
–
3.00 W
------------------------------------
13.33
°C/W
==
=
相關(guān)PDF資料
PDF描述
A40MX04-1VQ80I IC FPGA MX SGL CHIP 6K 80-VQFP
A40MX04-1VQG80I IC FPGA MX SGL CHIP 6K 80-VQFP
A54SX32A-FTQG100 IC FPGA SX 48K GATES 100-TQFP
A42MX09-VQ100 IC FPGA MX SGL CHIP 14K 100-VQFP
W29GL128CH9B IC FLASH 128MBIT 90NS 64LFBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A54SX08A-2PQ208A 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:SX-A Family FPGAs
A54SX08A-2PQ208B 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:SX-A Family FPGAs
A54SX08A-2PQ208I 功能描述:IC FPGA SX 12K GATES 208-PQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門(mén)數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A54SX08A-2PQ208M 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:SX-A Family FPGAs
A54SX08A-2PQG208 功能描述:IC FPGA SX 12K GATES 208-PQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:SX-A 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門(mén)數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠(chǎng)商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*