參數(shù)資料
型號: A42MX36-1BG272
廠商: Microsemi SoC
文件頁數(shù): 81/142頁
文件大?。?/td> 0K
描述: IC FPGA MX SGL CHIP 54K 272-PBGA
標(biāo)準包裝: 40
系列: MX
RAM 位總計: 2560
輸入/輸出數(shù): 202
門數(shù): 54000
電源電壓: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 272-BBGA
供應(yīng)商設(shè)備封裝: 272-PBGA(27x27)
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 39
PCI System Timing Specification
Table 1-26 and Table 1-27 list the critical PCI timing parameters and the corresponding timing
parameters for the MX PCI-compliant devices.
PCI Models
Microsemi provides synthesizable VHDL and Verilog-HDL models for a PCI Target interface, a PCI
Target and Target+DMA Master interface. Contact your Microsemi sales representative for more
details.
Table 1-26 Clock Specification for 33 MHz PCI
Symbol
Parameter
PCI
A42MX24
A42MX36
Units
Min.
Max.
Min.
Max.
Min.
Max.
tCYC
CLK Cycle Time
30
–4.0–4.0
ns
tHIGH
CLK High Time
11
–1.9–1.9
ns
tLOW
CLK Low Time
11
–1.9–1.9
ns
Table 1-27 Timing Parameters for 33 MHz PCI
PCI
A42MX24
A42MX36
Symbol
Parameter
Min.
Max. Min. Max. Min. Max. Units
tVAL
CLK to Signal Valid—Bused Signals
2
11
2.0
9.0
2.0
9.0
ns
tVAL(PTP) CLK to Signal Valid—Point-to-Point
2 2
12
2.0
9.0
2.0
9.0
ns
tON
Float to Active
2
2.0
4.0
2.0
4.0
ns
tOFF
Active to Float
28
8.31
–8.31
ns
tSU
Input Set-Up Time to CLK—Bused Signals
7
1.5
1.5
ns
tSU(PTP) Input Set-Up Time to CLK—Point-to-Point
10, 122
1.5
1.5
ns
tH
Input Hold to CLK
0
0
0
ns
Notes:
1. TOFF is system dependent. MX PCI devices have 7.4 ns turn-off time, reflection is typically an additional
10 ns.
2. REQ# and GNT# are point-to-point signals and have different output valid delay and input setup times
than do bussed signals. GNT# has a setup of 10; REW# has a setup of 12.
相關(guān)PDF資料
PDF描述
A42MX36-1BGG272 IC FPGA MX SGL CHIP 54K 272-PBGA
EP4CGX110DF31C7 IC CYCLONE IV FPGA 110K 896FBGA
A42MX36-1PQG208I IC FPGA MX SGL CHIP 54K 208-PQFP
A42MX36-1PQ208I IC FPGA MX SGL CHIP 54K 208-PQFP
EP1SGX10CF672C6N IC STRATIX GX FPGA 10KLE 672FBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A42MX36-1BG272I 功能描述:IC FPGA MX SGL CHIP 54K 272-PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標(biāo)準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
A42MX36-1BG272M 制造商:Microsemi Corporation 功能描述:FPGA 42MX Family 54K Gates 1184 Cells 90MHz/151MHz 0.45um Technology 3.3V/5V 272-Pin BGA 制造商:Microsemi Corporation 功能描述:FPGA 54K GATES 1184 CELLS 90MHZ/151MHZ 0.45UM 3.3V/5V 272BGA - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 54K 272-PBGA
A42MX36-1BGG272 功能描述:IC FPGA MX SGL CHIP 54K 272-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
A42MX36-1BGG272I 功能描述:IC FPGA MX SGL CHIP 54K 272-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標(biāo)準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
A42MX36-1BGG272M 制造商:Microsemi Corporation 功能描述:FPGA 54K GATES 1184 CELLS 90MHZ/151MHZ 0.45UM 3.3V/5V 272BGA - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 202 I/O 272PBGA