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鍙冩暩(sh霉)璩囨枡
鍨嬭櫉锛� A42MX24-2TQG176
寤犲晢锛� Microsemi SoC
鏂囦欢闋佹暩(sh霉)锛� 126/142闋�
鏂囦欢澶у皬锛� 0K
鎻忚堪锛� IC FPGA MX SGL CHIP 36K 176-TQFP
妯�(bi膩o)婧�(zh菙n)鍖呰锛� 40
绯诲垪锛� MX
杓稿叆/杓稿嚭鏁�(sh霉)锛� 150
闁€鏁�(sh霉)锛� 36000
闆绘簮闆诲锛� 3 V ~ 3.6 V锛�4.75 V ~ 5.25 V
瀹夎椤炲瀷锛� 琛ㄩ潰璨艰
宸ヤ綔婧害锛� 0°C ~ 70°C
灏佽/澶栨锛� 176-LQFP
渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 176-TQFP锛�24x24锛�
绗�1闋�绗�2闋�绗�3闋�绗�4闋�绗�5闋�绗�6闋�绗�7闋�绗�8闋�绗�9闋�绗�10闋�绗�11闋�绗�12闋�绗�13闋�绗�14闋�绗�15闋�绗�16闋�绗�17闋�绗�18闋�绗�19闋�绗�20闋�绗�21闋�绗�22闋�绗�23闋�绗�24闋�绗�25闋�绗�26闋�绗�27闋�绗�28闋�绗�29闋�绗�30闋�绗�31闋�绗�32闋�绗�33闋�绗�34闋�绗�35闋�绗�36闋�绗�37闋�绗�38闋�绗�39闋�绗�40闋�绗�41闋�绗�42闋�绗�43闋�绗�44闋�绗�45闋�绗�46闋�绗�47闋�绗�48闋�绗�49闋�绗�50闋�绗�51闋�绗�52闋�绗�53闋�绗�54闋�绗�55闋�绗�56闋�绗�57闋�绗�58闋�绗�59闋�绗�60闋�绗�61闋�绗�62闋�绗�63闋�绗�64闋�绗�65闋�绗�66闋�绗�67闋�绗�68闋�绗�69闋�绗�70闋�绗�71闋�绗�72闋�绗�73闋�绗�74闋�绗�75闋�绗�76闋�绗�77闋�绗�78闋�绗�79闋�绗�80闋�绗�81闋�绗�82闋�绗�83闋�绗�84闋�绗�85闋�绗�86闋�绗�87闋�绗�88闋�绗�89闋�绗�90闋�绗�91闋�绗�92闋�绗�93闋�绗�94闋�绗�95闋�绗�96闋�绗�97闋�绗�98闋�绗�99闋�绗�100闋�绗�101闋�绗�102闋�绗�103闋�绗�104闋�绗�105闋�绗�106闋�绗�107闋�绗�108闋�绗�109闋�绗�110闋�绗�111闋�绗�112闋�绗�113闋�绗�114闋�绗�115闋�绗�116闋�绗�117闋�绗�118闋�绗�119闋�绗�120闋�绗�121闋�绗�122闋�绗�123闋�绗�124闋�绗�125闋�鐣�(d膩ng)鍓嶇126闋�绗�127闋�绗�128闋�绗�129闋�绗�130闋�绗�131闋�绗�132闋�绗�133闋�绗�134闋�绗�135闋�绗�136闋�绗�137闋�绗�138闋�绗�139闋�绗�140闋�绗�141闋�绗�142闋�
40MX and 42MX FPGA Families
1- 80
R e v i sio n 1 1
Synchronous SRAM Operations (continued)
tADH
Address/Data Hold Time
0.0
ns
tRENSU
Read Enable Set-Up
0.9
1.0
1.1
1.3
1.8
ns
tRENH
Read Enable Hold
4.8
5.3
6.0
7.0
9.8
ns
tWENSU
Write Enable Set-Up
3.8
4.2
4.8
5.6
7.8
ns
tWENH
Write Enable Hold
0.0
ns
tBENS
Block Enable Set-Up
3.9
4.3
4.9
5.7
8.0
ns
tBENH
Block Enable Hold
0.0
ns
Asynchronous SRAM Operations
tRPD
Asynchronous Access Time
11.3
12.6
14.3
16.8
23.5
ns
tRDADV
Read Address Valid
12.3
13.7
15.5
18.2
25.5
ns
tADSU
Address/Data Set-Up Time
2.3
2.5
2.8
3.4
4.8
ns
tADH
Address/Data Hold Time
0.0
ns
tRENSUA
Read Enable Set-Up to Address
Valid
0.9
1.0
1.1
1.3
1.8
ns
tRENHA
Read Enable Hold
4.8
5.3
6.0
7.0
9.8
ns
tWENSU
Write Enable Set-Up
3.8
4.2
4.8
5.6
7.8
ns
tWENH
Write Enable Hold
0.0
ns
tDOH
Data Out Hold Time
1.8
2.0
2.1
2.5
3.5
ns
Input Module Propagation Delays
tINPY
Input Data Pad-to-Y
1.4
1.6
1.8
2.1
3.0
ns
tINGO
Input Latch Gate-to-Output
2.0
2.2
2.5
2.9
4.1
ns
tINH
Input Latch Hold
0.0
ns
tINSU
Input Latch Set-Up
0.7
0.8
1.0
1.4
ns
tILA
Latch Active Pulse Width
6.5
7.3
8.2
9.7
13.5
ns
Table 1-39 A42MX36 Timing Characteristics (Nominal 3.3 V Operation) (continued)
(Worst-Case Commercial Conditions, VCCA = 3.0 V, TJ = 70掳C)
鈥�3 Speed
鈥�2 Speed
鈥�1 Speed
Std Speed 鈥揊 Speed
Parameter / Description
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input.
External setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an
external PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
鐩搁棞(gu膩n)PDF璩囨枡
PDF鎻忚堪
A42MX24-2TQ176 IC FPGA MX SGL CHIP 36K 176-TQFP
EP4CGX50CF23I7N IC CYCLONE IV GX FPGA 50K 484FBG
RMC12DTEH CONN EDGECARD 24POS .100 EYELET
AMM28DRKI-S13 CONN EDGECARD 56POS .156 EXTEND
AT24C128C-XHM-T IC EEPROM 128KBIT 400KHZ 8TSSOP
鐩搁棞(gu膩n)浠g悊鍟�/鎶€琛�(sh霉)鍙冩暩(sh霉)
鍙冩暩(sh霉)鎻忚堪
A42MX24-2TQG176I 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 36K 176-TQFP RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄e垪锛� 绯诲垪:MX 鐢�(ch菐n)鍝佸煿瑷�(x霉n)妯″:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 鐗硅壊鐢�(ch菐n)鍝�:Cyclone? IV FPGAs 妯�(bi膩o)婧�(zh菙n)鍖呰:60 绯诲垪:CYCLONE® IV GX LAB/CLB鏁�(sh霉):9360 閭忚集鍏冧欢/鍠厓鏁�(sh霉):149760 RAM 浣嶇附瑷�(j矛):6635520 杓稿叆/杓稿嚭鏁�(sh霉):270 闁€鏁�(sh霉):- 闆绘簮闆诲:1.16 V ~ 1.24 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 85°C 灏佽/澶栨:484-BGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:484-FBGA锛�23x23锛�
A42MX24-3PL84 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 36K 84-PLCC RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄e垪锛� 绯诲垪:MX 鐢�(ch菐n)鍝佸煿瑷�(x霉n)妯″:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 鐗硅壊鐢�(ch菐n)鍝�:Cyclone? IV FPGAs 妯�(bi膩o)婧�(zh菙n)鍖呰:60 绯诲垪:CYCLONE® IV GX LAB/CLB鏁�(sh霉):9360 閭忚集鍏冧欢/鍠厓鏁�(sh霉):149760 RAM 浣嶇附瑷�(j矛):6635520 杓稿叆/杓稿嚭鏁�(sh霉):270 闁€鏁�(sh霉):- 闆绘簮闆诲:1.16 V ~ 1.24 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 85°C 灏佽/澶栨:484-BGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:484-FBGA锛�23x23锛�
A42MX24-3PL84I 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 36K 84-PLCC RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄e垪锛� 绯诲垪:MX 鐢�(ch菐n)鍝佸煿瑷�(x霉n)妯″:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 鐗硅壊鐢�(ch菐n)鍝�:Cyclone? IV FPGAs 妯�(bi膩o)婧�(zh菙n)鍖呰:60 绯诲垪:CYCLONE® IV GX LAB/CLB鏁�(sh霉):9360 閭忚集鍏冧欢/鍠厓鏁�(sh霉):149760 RAM 浣嶇附瑷�(j矛):6635520 杓稿叆/杓稿嚭鏁�(sh霉):270 闁€鏁�(sh霉):- 闆绘簮闆诲:1.16 V ~ 1.24 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 85°C 灏佽/澶栨:484-BGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:484-FBGA锛�23x23锛�
A42MX24-3PLG84 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 36K 84-PLCC RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄e垪锛� 绯诲垪:MX 鐢�(ch菐n)鍝佸煿瑷�(x霉n)妯″:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 鐗硅壊鐢�(ch菐n)鍝�:Cyclone? IV FPGAs 妯�(bi膩o)婧�(zh菙n)鍖呰:60 绯诲垪:CYCLONE® IV GX LAB/CLB鏁�(sh霉):9360 閭忚集鍏冧欢/鍠厓鏁�(sh霉):149760 RAM 浣嶇附瑷�(j矛):6635520 杓稿叆/杓稿嚭鏁�(sh霉):270 闁€鏁�(sh霉):- 闆绘簮闆诲:1.16 V ~ 1.24 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 85°C 灏佽/澶栨:484-BGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:484-FBGA锛�23x23锛�
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