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    參數(shù)資料
    型號: A42MX16-3VQG100I
    廠商: Microsemi SoC
    文件頁數(shù): 103/142頁
    文件大?。?/td> 0K
    描述: IC FPGA MX SGL CHIP 24K 100-VQFP
    標準包裝: 90
    系列: MX
    輸入/輸出數(shù): 83
    門數(shù): 24000
    電源電壓: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
    安裝類型: 表面貼裝
    工作溫度: -40°C ~ 85°C
    封裝/外殼: 100-TQFP
    供應(yīng)商設(shè)備封裝: 100-VQFP(14x14)
    40MX and 42MX FPGA Families
    Re vi s i on 11
    1 - 59
    CMOS Output Module Timing5
    tDLH
    Data-to-Pad HIGH
    3.4
    3.8
    5.5
    6.4
    9.0
    ns
    tDHL
    Data-to-Pad LOW
    4.1
    4.5
    4.2
    5.0
    7.0
    ns
    tENZH
    Enable Pad Z to HIGH
    3.7
    4.1
    4.6
    5.5
    7.6
    ns
    tENZL
    Enable Pad Z to LOW
    4.1
    4.5
    5.1
    6.1
    8.5
    ns
    tENHZ
    Enable Pad HIGH to Z
    6.9
    7.6
    8.6
    10.2
    14.2
    ns
    tENLZ
    Enable Pad LOW to Z
    7.5
    8.3
    9.4
    11.1
    15.5
    ns
    tGLH
    G-to-Pad HIGH
    5.8
    6.5
    7.3
    8.6
    12.0
    ns
    tGHL
    G-to-Pad LOW
    5.8
    6.5
    7.3
    8.6
    12.0
    ns
    tLSU
    I/O Latch Set-Up
    0.7
    0.8
    0.9
    1.0
    1.4
    ns
    tLH
    I/O Latch Hold
    0.0
    ns
    tLCO
    I/O Latch Clock-to-Out
    (Pad-to-Pad), 64 Clock Loading
    8.7
    9.7
    10.9
    12.9
    18.0
    ns
    tACO
    Array Clock-to-Out
    (Pad-to-Pad),
    64 Clock Loading
    12.2
    13.5
    15.4
    18.1
    25.3
    ns
    dTLH
    Capacity Loading, LOW to HIGH
    0.04
    0.05
    0.06
    0.08 ns/pF
    dTHL
    Capacity Loading, HIGH to LOW
    0.05
    0.06
    0.07
    0.10 ns/pF
    Table 1-33 A42MX09 Timing Characteristics (Nominal 3.3 V Operation) (continued)
    (Worst-Case Commercial Conditions, VCCA = 3.0 V, TJ = 70°C)
    –3 Speed
    –2 Speed
    –1 Speed
    Std Speed
    –F Speed
    Units
    Parameter / Description
    Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
    Notes:
    1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
    2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
    estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
    3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
    can be obtained from the Timer utility.
    4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External
    setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external
    PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
    5. Delays based on 35 pF loading.
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