tINYH Pad-to-Y HIGH " />
<pre id="wbnz6"><span id="wbnz6"></span></pre>
  • 參數(shù)資料
    型號: A42MX09-TQ176I
    廠商: Microsemi SoC
    文件頁數(shù): 96/142頁
    文件大小: 0K
    描述: IC FPGA MX SGL CHIP 14K 176-TQFP
    標(biāo)準(zhǔn)包裝: 40
    系列: MX
    輸入/輸出數(shù): 104
    門數(shù): 14000
    電源電壓: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
    安裝類型: 表面貼裝
    工作溫度: -40°C ~ 85°C
    封裝/外殼: 176-LQFP
    供應(yīng)商設(shè)備封裝: 176-TQFP(24x24)
    40MX and 42MX FPGA Families
    Re vi s i on 11
    1 - 53
    Input Module Propagation Delays
    tINYH
    Pad-to-Y HIGH
    1.0
    1.2
    1.3
    1.6
    2.2
    ns
    tINYL
    Pad-to-Y LOW
    0.8
    0.9
    1.0
    1.2
    1.7
    ns
    tINGH
    G to Y HIGH
    1.3
    1.4
    1.6
    1.9
    2.7
    ns
    tINGL
    G to Y LOW
    1.3
    1.4
    1.6
    1.9
    2.7
    ns
    Input Module Predicted Routing Delays2
    tIRD1
    FO = 1 Routing Delay
    2.0
    2.2
    2.5
    3.0
    4.2
    ns
    tIRD2
    FO = 2 Routing Delay
    2.3
    2.5
    2.9
    3.4
    4.7
    ns
    tIRD3
    FO = 3 Routing Delay
    2.5
    2.8
    3.2
    3.7
    5.2
    ns
    tIRD4
    FO = 4 Routing Delay
    2.8
    3.1
    3.5
    4.1
    5.7
    ns
    tIRD8
    FO = 8 Routing Delay
    3.7
    4.1
    4.7
    5.5
    7.7
    ns
    Global Clock Network
    tCKH
    Input LOW to HIGH
    FO = 32
    FO = 256
    2.4
    2.7
    3.0
    3.4
    3.6
    4.0
    5.0
    5.5
    ns
    tCKL
    Input HIGH to LOW
    FO = 32
    FO = 256
    3.5
    3.9
    4.3
    4.4
    4.9
    5.2
    5.7
    7.3
    8.0
    ns
    tPWH
    Minimum Pulse
    Width HIGH
    FO = 32
    FO = 256
    1.2
    1.3
    1.4
    1.5
    1.7
    1.8
    2.0
    2.5
    2.7
    ns
    tPWL
    Minimum Pulse
    Width LOW
    FO = 32
    FO = 256
    1.2
    1.3
    1.4
    1.5
    1.7
    1.8
    2.0
    2.5
    2.7
    ns
    tCKSW
    Maximum Skew
    FO = 32
    FO = 256
    0.3
    0.4
    0.5
    0.6
    ns
    tSUEXT
    Input Latch
    External Set-Up
    FO = 32
    FO = 256
    0.0
    ns
    tHEXT
    Input Latch
    External Hold
    FO = 32
    FO = 256
    2.3
    2.2
    2.6
    2.4
    3.0
    3.3
    3.5
    3.9
    4.9
    5.5
    ns
    tP
    Minimum Period
    FO = 32
    FO = 256
    3.4
    3.7
    4.1
    4.0
    4.5
    4.7
    5.2
    7.8
    8.6
    ns
    fMAX
    Maximum Frequency FO = 32
    FO = 256
    296
    268
    269
    244
    247
    224
    215
    195
    129
    117
    MHz
    Table 1-32 A42MX09 Timing Characteristics (Nominal 5.0 V Operation) (continued)
    (Worst-Case Commercial Conditions, VCCA = 4.75 V, TJ = 70°C)
    –3 Speed
    –2 Speed
    –1 Speed
    Std Speed
    –F Speed
    Units
    Parameter / Description
    Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
    Notes:
    1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
    2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
    estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
    3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
    can be obtained from the Timer utility.
    4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External
    setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external
    PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
    5. Delays based on 35 pF loading.
    相關(guān)PDF資料
    PDF描述
    A42MX16-PQ100A IC FPGA MX SGL CHIP 24K 100-PQFP
    A42MX09-TQG176A IC FPGA MX SGL CHIP 14K 176-TQFP
    A42MX09-TQ176A IC FPGA MX SGL CHIP 14K 176-TQFP
    EP4CGX30BF14I7 IC CYCLONE IV GX FPGA 30K 169FBG
    EP4CGX30BF14C6 IC CYCLONE IV GX FPGA 30K 169FBG
    相關(guān)代理商/技術(shù)參數(shù)
    參數(shù)描述
    A42MX09-TQ176M 制造商:Microsemi Corporation 功能描述:FPGA 14K GATES 336 CELLS 129MHZ/215MHZ 0.45UM 3.3V/5V 176TQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 14K 176-TQFP 制造商:Microsemi Corporation 功能描述:IC FPGA 104 I/O 176TQFP
    A42MX09-TQ208A 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:40MX and 42MX Automotive FPGA Families
    A42MX09-TQG176 功能描述:IC FPGA 104I/O 176TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計(jì):221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA(23x23) 其它名稱:220-1241
    A42MX09-TQG176A 功能描述:IC FPGA MX SGL CHIP 14K 176-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
    A42MX09-TQG176I 功能描述:IC FPGA MX SGL CHIP 14K 176-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)