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鍙冩暩(sh霉)璩囨枡
| 鍨嬭櫉锛� | A42MX09-3PLG84I |
| 寤犲晢锛� | Microsemi SoC |
| 鏂囦欢闋佹暩(sh霉)锛� | 120/142闋� |
| 鏂囦欢澶�?銆�?/td> | 0K |
| 鎻忚堪锛� | IC FPGA MX SGL CHIP 14K 84-PLCC |
| 妯欐簴鍖呰锛� | 16 |
| 绯诲垪锛� | MX |
| 杓稿叆/杓稿嚭鏁�(sh霉)锛� | 72 |
| 闁€鏁�(sh霉)锛� | 14000 |
| 闆绘簮闆诲锛� | 3 V ~ 3.6 V锛�4.5 V ~ 5.5 V |
| 瀹夎椤炲瀷锛� | 琛ㄩ潰璨艰 |
| 宸ヤ綔婧害锛� | -40°C ~ 85°C |
| 灏佽/澶栨锛� | 84-LCC锛圝 褰㈠紩绶氾級 |
| 渚涙噳鍟嗚ō鍌欏皝瑁濓細 | 84-PLCC锛�29.31x29.31锛� |
绗�1闋�绗�2闋�绗�3闋�绗�4闋�绗�5闋�绗�6闋�绗�7闋�绗�8闋�绗�9闋�绗�10闋�绗�11闋�绗�12闋�绗�13闋�绗�14闋�绗�15闋�绗�16闋�绗�17闋�绗�18闋�绗�19闋�绗�20闋�绗�21闋�绗�22闋�绗�23闋�绗�24闋�绗�25闋�绗�26闋�绗�27闋�绗�28闋�绗�29闋�绗�30闋�绗�31闋�绗�32闋�绗�33闋�绗�34闋�绗�35闋�绗�36闋�绗�37闋�绗�38闋�绗�39闋�绗�40闋�绗�41闋�绗�42闋�绗�43闋�绗�44闋�绗�45闋�绗�46闋�绗�47闋�绗�48闋�绗�49闋�绗�50闋�绗�51闋�绗�52闋�绗�53闋�绗�54闋�绗�55闋�绗�56闋�绗�57闋�绗�58闋�绗�59闋�绗�60闋�绗�61闋�绗�62闋�绗�63闋�绗�64闋�绗�65闋�绗�66闋�绗�67闋�绗�68闋�绗�69闋�绗�70闋�绗�71闋�绗�72闋�绗�73闋�绗�74闋�绗�75闋�绗�76闋�绗�77闋�绗�78闋�绗�79闋�绗�80闋�绗�81闋�绗�82闋�绗�83闋�绗�84闋�绗�85闋�绗�86闋�绗�87闋�绗�88闋�绗�89闋�绗�90闋�绗�91闋�绗�92闋�绗�93闋�绗�94闋�绗�95闋�绗�96闋�绗�97闋�绗�98闋�绗�99闋�绗�100闋�绗�101闋�绗�102闋�绗�103闋�绗�104闋�绗�105闋�绗�106闋�绗�107闋�绗�108闋�绗�109闋�绗�110闋�绗�111闋�绗�112闋�绗�113闋�绗�114闋�绗�115闋�绗�116闋�绗�117闋�绗�118闋�绗�119闋�鐣跺墠绗�120闋�绗�121闋�绗�122闋�绗�123闋�绗�124闋�绗�125闋�绗�126闋�绗�127闋�绗�128闋�绗�129闋�绗�130闋�绗�131闋�绗�132闋�绗�133闋�绗�134闋�绗�135闋�绗�136闋�绗�137闋�绗�138闋�绗�139闋�绗�140闋�绗�141闋�绗�142闋�
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 75
tRENSU
Read Enable Set-Up
0.6
0.7
0.8
0.9
1.3
ns
tRENH
Read Enable Hold
3.4
3.8
4.3
5.0
7.0
ns
tWENSU
Write Enable Set-Up
2.7
3.0
3.4
4.0
5.6
ns
tWENH
Write Enable Hold
0.0
ns
tBENS
Block Enable Set-Up
2.8
3.1
3.5
4.1
5.7
ns
tBENH
Block Enable Hold
0.0
ns
Asynchronous SRAM Operations
tRPD
Asynchronous Access Time
8.1
9.0
10.2
12.0
16.8
ns
tRDADV
Read Address Valid
8.8
9.8
11.1
13.0
18.2
ns
tADSU
Address/Data Set-Up Time
1.6
1.8
2.0
2.4
3.4
ns
tADH
Address/Data Hold Time
0.0
ns
tRENSUA Read Enable Set-Up to Address
Valid
0.6
0.7
0.8
0.9
1.3
ns
tRENHA
Read Enable Hold
3.4
3.8
4.3
5.0
7.0
ns
tWENSU
Write Enable Set-Up
2.7
3.0
3.4
4.0
5.6
ns
tWENH
Write Enable Hold
0.0
ns
tDOH
Data Out Hold Time
1.2
1.3
1.5
1.8
2.5
ns
Input Module Propagation Delays
tINPY
Input Data Pad-to-Y
1.0
1.1
1.3
1.5
2.1
ns
tINGO
Input Latch Gate-to-Output
1.4
1.6
1.8
2.1
2.9
ns
tINH
Input Latch Hold
0.0
ns
tINSU
Input Latch Set-Up
0.5
0.6
0.7
1.0
ns
tILA
Latch Active Pulse Width
4.7
5.2
5.9
6.9
9.7
ns
Input Module Predicted Routing Delays2
tIRD1
FO = 1 Routing Delay
2.0
2.2
2.5
2.9
4.1
ns
tIRD2
FO = 2 Routing Delay
2.3
2.6
2.9
3.4
4.8
ns
tIRD3
FO = 3 Routing Delay
2.6
2.9
3.3
3.9
5.5
ns
tIRD4
FO = 4 Routing Delay
3.0
3.3
3.8
4.4
6.2
ns
tIRD8
FO = 8 Routing Delay
4.3
4.8
5.5
6.4
9.0
ns
Table 1-38 A42MX36 Timing Characteristics (Nominal 5.0 V Operation)
(Worst-Case Commercial Conditions, VCCA = 4.75 V, TJ = 70掳C)
鈥�3 Speed
鈥�2 Speed
鈥�1 Speed
Std Speed
鈥揊 Speed
Parameter / Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max. Units
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input.
External setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an
external PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
鐩搁棞PDF璩囨枡 |
PDF鎻忚堪 |
|---|---|
| 977-009-020R121 | BACKSHELL DB9 METALIZED PLASTIC |
| A54SX08-1PLG84I | IC FPGA SX 12K GATES 84-PLCC |
| 977-025-010R031 | BACKSHELL DB25 GREY PLASTIC |
| 10320-52F0-008 | CONN JUNCTION SHELL 20POS STRGT |
| FMM18DSEN-S13 | CONN EDGECARD 36POS .156 EXTEND |
鐩搁棞浠ｇ悊鍟�/鎶€琛撳弮鏁�(sh霉) |
鍙冩暩(sh霉)鎻忚堪 |
|---|---|
| A42MX09-3PQ100 | 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 14K 100-PQFP RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄ｅ垪锛� 绯诲垪:MX 妯欐簴鍖呰:40 绯诲垪:SX-A LAB/CLB鏁�(sh霉):6036 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�:- 杓稿叆/杓稿嚭鏁�(sh霉):360 闁€鏁�(sh霉):108000 闆绘簮闆诲:2.25 V ~ 5.25 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 70°C 灏佽/澶栨:484-BGA 渚涙噳鍟嗚ō鍌欏皝瑁�:484-FPBGA锛�27X27锛� |
| A42MX09-3PQ100A | 鍒堕€犲晢:鏈煡寤犲 鍒堕€犲晢鍏ㄧū:鏈煡寤犲 鍔熻兘鎻忚堪:40MX and 42MX FPGA Families |
| A42MX09-3PQ100B | 鍒堕€犲晢:鏈煡寤犲 鍒堕€犲晢鍏ㄧū:鏈煡寤犲 鍔熻兘鎻忚堪:40MX and 42MX FPGA Families |
| A42MX09-3PQ100ES | 鍒堕€犲晢:鏈煡寤犲 鍒堕€犲晢鍏ㄧū:鏈煡寤犲 鍔熻兘鎻忚堪:40MX and 42MX FPGA Families |
| A42MX09-3PQ100I | 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 14K 100-PQFP RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄ｅ垪锛� 绯诲垪:MX 妯欐簴鍖呰:40 绯诲垪:SX-A LAB/CLB鏁�(sh霉):6036 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�:- 杓稿叆/杓稿嚭鏁�(sh霉):360 闁€鏁�(sh霉):108000 闆绘簮闆诲:2.25 V ~ 5.25 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 70°C 灏佽/澶栨:484-BGA 渚涙噳鍟嗚ō鍌欏皝瑁�:484-FPBGA锛�27X27锛� |
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