- 鎮ㄧ従(xi脿n)鍦ㄧ殑浣嶇疆锛�璨�(m菐i)璩�(m脿i)IC缍�(w菐ng) > PDF鐩寗4479 > A42MX09-1VQ100 (Microsemi SoC)IC FPGA MX SGL CHIP 14K 100VQFP PDF璩囨枡涓嬭級
鍙冩暩(sh霉)璩囨枡
| 鍨嬭櫉(h脿o)锛� | A42MX09-1VQ100 |
| 寤犲晢锛� | Microsemi SoC |
| 鏂囦欢闋�(y猫)鏁�(sh霉)锛� | 120/142闋�(y猫) |
| 鏂囦欢澶у皬锛� | 0K |
| 鎻忚堪锛� | IC FPGA MX SGL CHIP 14K 100VQFP |
| 妯�(bi膩o)婧�(zh菙n)鍖呰锛� | 90 |
| 绯诲垪锛� | MX |
| 杓稿叆/杓稿嚭鏁�(sh霉)锛� | 83 |
| 闁€(m茅n)鏁�(sh霉)锛� | 14000 |
| 闆绘簮闆诲锛� | 3 V ~ 3.6 V锛�4.75 V ~ 5.25 V |
| 瀹夎椤�(l猫i)鍨嬶細 | 琛ㄩ潰璨艰 |
| 宸ヤ綔婧害锛� | 0°C ~ 70°C |
| 灏佽/澶栨锛� | 100-TQFP |
| 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 | 100-VQFP锛�14x14锛� |
绗�1闋�(y猫)绗�2闋�(y猫)绗�3闋�(y猫)绗�4闋�(y猫)绗�5闋�(y猫)绗�6闋�(y猫)绗�7闋�(y猫)绗�8闋�(y猫)绗�9闋�(y猫)绗�10闋�(y猫)绗�11闋�(y猫)绗�12闋�(y猫)绗�13闋�(y猫)绗�14闋�(y猫)绗�15闋�(y猫)绗�16闋�(y猫)绗�17闋�(y猫)绗�18闋�(y猫)绗�19闋�(y猫)绗�20闋�(y猫)绗�21闋�(y猫)绗�22闋�(y猫)绗�23闋�(y猫)绗�24闋�(y猫)绗�25闋�(y猫)绗�26闋�(y猫)绗�27闋�(y猫)绗�28闋�(y猫)绗�29闋�(y猫)绗�30闋�(y猫)绗�31闋�(y猫)绗�32闋�(y猫)绗�33闋�(y猫)绗�34闋�(y猫)绗�35闋�(y猫)绗�36闋�(y猫)绗�37闋�(y猫)绗�38闋�(y猫)绗�39闋�(y猫)绗�40闋�(y猫)绗�41闋�(y猫)绗�42闋�(y猫)绗�43闋�(y猫)绗�44闋�(y猫)绗�45闋�(y猫)绗�46闋�(y猫)绗�47闋�(y猫)绗�48闋�(y猫)绗�49闋�(y猫)绗�50闋�(y猫)绗�51闋�(y猫)绗�52闋�(y猫)绗�53闋�(y猫)绗�54闋�(y猫)绗�55闋�(y猫)绗�56闋�(y猫)绗�57闋�(y猫)绗�58闋�(y猫)绗�59闋�(y猫)绗�60闋�(y猫)绗�61闋�(y猫)绗�62闋�(y猫)绗�63闋�(y猫)绗�64闋�(y猫)绗�65闋�(y猫)绗�66闋�(y猫)绗�67闋�(y猫)绗�68闋�(y猫)绗�69闋�(y猫)绗�70闋�(y猫)绗�71闋�(y猫)绗�72闋�(y猫)绗�73闋�(y猫)绗�74闋�(y猫)绗�75闋�(y猫)绗�76闋�(y猫)绗�77闋�(y猫)绗�78闋�(y猫)绗�79闋�(y猫)绗�80闋�(y猫)绗�81闋�(y猫)绗�82闋�(y猫)绗�83闋�(y猫)绗�84闋�(y猫)绗�85闋�(y猫)绗�86闋�(y猫)绗�87闋�(y猫)绗�88闋�(y猫)绗�89闋�(y猫)绗�90闋�(y猫)绗�91闋�(y猫)绗�92闋�(y猫)绗�93闋�(y猫)绗�94闋�(y猫)绗�95闋�(y猫)绗�96闋�(y猫)绗�97闋�(y猫)绗�98闋�(y猫)绗�99闋�(y猫)绗�100闋�(y猫)绗�101闋�(y猫)绗�102闋�(y猫)绗�103闋�(y猫)绗�104闋�(y猫)绗�105闋�(y猫)绗�106闋�(y猫)绗�107闋�(y猫)绗�108闋�(y猫)绗�109闋�(y猫)绗�110闋�(y猫)绗�111闋�(y猫)绗�112闋�(y猫)绗�113闋�(y猫)绗�114闋�(y猫)绗�115闋�(y猫)绗�116闋�(y猫)绗�117闋�(y猫)绗�118闋�(y猫)绗�119闋�(y猫)鐣�(d膩ng)鍓嶇120闋�(y猫)绗�121闋�(y猫)绗�122闋�(y猫)绗�123闋�(y猫)绗�124闋�(y猫)绗�125闋�(y猫)绗�126闋�(y猫)绗�127闋�(y猫)绗�128闋�(y猫)绗�129闋�(y猫)绗�130闋�(y猫)绗�131闋�(y猫)绗�132闋�(y猫)绗�133闋�(y猫)绗�134闋�(y猫)绗�135闋�(y猫)绗�136闋�(y猫)绗�137闋�(y猫)绗�138闋�(y猫)绗�139闋�(y猫)绗�140闋�(y猫)绗�141闋�(y猫)绗�142闋�(y猫)
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 75
tRENSU
Read Enable Set-Up
0.6
0.7
0.8
0.9
1.3
ns
tRENH
Read Enable Hold
3.4
3.8
4.3
5.0
7.0
ns
tWENSU
Write Enable Set-Up
2.7
3.0
3.4
4.0
5.6
ns
tWENH
Write Enable Hold
0.0
ns
tBENS
Block Enable Set-Up
2.8
3.1
3.5
4.1
5.7
ns
tBENH
Block Enable Hold
0.0
ns
Asynchronous SRAM Operations
tRPD
Asynchronous Access Time
8.1
9.0
10.2
12.0
16.8
ns
tRDADV
Read Address Valid
8.8
9.8
11.1
13.0
18.2
ns
tADSU
Address/Data Set-Up Time
1.6
1.8
2.0
2.4
3.4
ns
tADH
Address/Data Hold Time
0.0
ns
tRENSUA Read Enable Set-Up to Address
Valid
0.6
0.7
0.8
0.9
1.3
ns
tRENHA
Read Enable Hold
3.4
3.8
4.3
5.0
7.0
ns
tWENSU
Write Enable Set-Up
2.7
3.0
3.4
4.0
5.6
ns
tWENH
Write Enable Hold
0.0
ns
tDOH
Data Out Hold Time
1.2
1.3
1.5
1.8
2.5
ns
Input Module Propagation Delays
tINPY
Input Data Pad-to-Y
1.0
1.1
1.3
1.5
2.1
ns
tINGO
Input Latch Gate-to-Output
1.4
1.6
1.8
2.1
2.9
ns
tINH
Input Latch Hold
0.0
ns
tINSU
Input Latch Set-Up
0.5
0.6
0.7
1.0
ns
tILA
Latch Active Pulse Width
4.7
5.2
5.9
6.9
9.7
ns
Input Module Predicted Routing Delays2
tIRD1
FO = 1 Routing Delay
2.0
2.2
2.5
2.9
4.1
ns
tIRD2
FO = 2 Routing Delay
2.3
2.6
2.9
3.4
4.8
ns
tIRD3
FO = 3 Routing Delay
2.6
2.9
3.3
3.9
5.5
ns
tIRD4
FO = 4 Routing Delay
3.0
3.3
3.8
4.4
6.2
ns
tIRD8
FO = 8 Routing Delay
4.3
4.8
5.5
6.4
9.0
ns
Table 1-38 A42MX36 Timing Characteristics (Nominal 5.0 V Operation)
(Worst-Case Commercial Conditions, VCCA = 4.75 V, TJ = 70掳C)
鈥�3 Speed
鈥�2 Speed
鈥�1 Speed
Std Speed
鈥揊 Speed
Parameter / Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max. Units
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input.
External setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an
external PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
鐩搁棞(gu膩n)PDF璩囨枡 |
PDF鎻忚堪 |
|---|---|
| A42MX09-VQG100I | IC FPGA MX SGL CHIP 14K 100-VQFP |
| A3P1000-1PQG208 | IC FPGA 1KB FLASH 1M 208-PQFP |
| EMC13DTEF | CONN EDGECARD 26POS .100 EYELET |
| ACB70DHFR | CONN EDGECARD 140POS .050 SMD |
| ABB70DHFR | CONN EDGECARD 140POS .050 SMD |
鐩搁棞(gu膩n)浠ｇ悊鍟�/鎶€琛�(sh霉)鍙冩暩(sh霉) |
鍙冩暩(sh霉)鎻忚堪 |
|---|---|
| A42MX09-1VQ100A | 鍒堕€犲晢:鏈煡寤犲 鍒堕€犲晢鍏ㄧū(ch膿ng):鏈煡寤犲 鍔熻兘鎻忚堪:40MX and 42MX FPGA Families |
| A42MX09-1VQ100B | 鍒堕€犲晢:鏈煡寤犲 鍒堕€犲晢鍏ㄧū(ch膿ng):鏈煡寤犲 鍔熻兘鎻忚堪:40MX and 42MX FPGA Families |
| A42MX09-1VQ100ES | 鍒堕€犲晢:鏈煡寤犲 鍒堕€犲晢鍏ㄧū(ch膿ng):鏈煡寤犲 鍔熻兘鎻忚堪:40MX and 42MX FPGA Families |
| A42MX09-1VQ100I | 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 14K 100VQFP RoHS:鍚� 椤�(l猫i)鍒�:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫�(ch菐ng)鍙法绋嬮杸(m茅n)闄ｅ垪锛� 绯诲垪:MX 妯�(bi膩o)婧�(zh菙n)鍖呰:40 绯诲垪:SX-A LAB/CLB鏁�(sh霉):6036 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�(j矛):- 杓稿叆/杓稿嚭鏁�(sh霉):360 闁€(m茅n)鏁�(sh霉):108000 闆绘簮闆诲:2.25 V ~ 5.25 V 瀹夎椤�(l猫i)鍨�:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 70°C 灏佽/澶栨:484-BGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:484-FPBGA锛�27X27锛� |
| A42MX09-1VQ100M | 鍒堕€犲晢:Microsemi Corporation 鍔熻兘鎻忚堪:FPGA 14K GATES 336 CELLS 148MHZ/247MHZ 0.45UM 3.3V/5V 100VQF - Trays 鍒堕€犲晢:Microsemi Corporation 鍔熻兘鎻忚堪:IC FPGA 83 I/O 100VQFP |
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