tRENSU Read Enable Set-Up 0.6 0.7 0.8 0.9 1.3 ns
鍙冩暩(sh霉)璩囨枡
鍨嬭櫉(h脿o)锛� A40MX04-VQ80
寤犲晢锛� Microsemi SoC
鏂囦欢闋佹暩(sh霉)锛� 120/142闋�
鏂囦欢澶�?銆�?/td> 0K
鎻忚堪锛� IC FPGA MX SGL CHIP 6K 80-VQFP
妯�(bi膩o)婧�(zh菙n)鍖呰锛� 90
绯诲垪锛� MX
杓稿叆/杓稿嚭鏁�(sh霉)锛� 69
闁€鏁�(sh霉)锛� 6000
闆绘簮闆诲锛� 3 V ~ 3.6 V锛�4.75 V ~ 5.25 V
瀹夎椤炲瀷锛� 琛ㄩ潰璨艰
宸ヤ綔婧害锛� 0°C ~ 70°C
灏佽/澶栨锛� 80-TQFP
渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 80-VQFP锛�14x14锛�
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40MX and 42MX FPGA Families
Re vi s i on 11
1 - 75
tRENSU
Read Enable Set-Up
0.6
0.7
0.8
0.9
1.3
ns
tRENH
Read Enable Hold
3.4
3.8
4.3
5.0
7.0
ns
tWENSU
Write Enable Set-Up
2.7
3.0
3.4
4.0
5.6
ns
tWENH
Write Enable Hold
0.0
ns
tBENS
Block Enable Set-Up
2.8
3.1
3.5
4.1
5.7
ns
tBENH
Block Enable Hold
0.0
ns
Asynchronous SRAM Operations
tRPD
Asynchronous Access Time
8.1
9.0
10.2
12.0
16.8
ns
tRDADV
Read Address Valid
8.8
9.8
11.1
13.0
18.2
ns
tADSU
Address/Data Set-Up Time
1.6
1.8
2.0
2.4
3.4
ns
tADH
Address/Data Hold Time
0.0
ns
tRENSUA Read Enable Set-Up to Address
Valid
0.6
0.7
0.8
0.9
1.3
ns
tRENHA
Read Enable Hold
3.4
3.8
4.3
5.0
7.0
ns
tWENSU
Write Enable Set-Up
2.7
3.0
3.4
4.0
5.6
ns
tWENH
Write Enable Hold
0.0
ns
tDOH
Data Out Hold Time
1.2
1.3
1.5
1.8
2.5
ns
Input Module Propagation Delays
tINPY
Input Data Pad-to-Y
1.0
1.1
1.3
1.5
2.1
ns
tINGO
Input Latch Gate-to-Output
1.4
1.6
1.8
2.1
2.9
ns
tINH
Input Latch Hold
0.0
ns
tINSU
Input Latch Set-Up
0.5
0.6
0.7
1.0
ns
tILA
Latch Active Pulse Width
4.7
5.2
5.9
6.9
9.7
ns
Input Module Predicted Routing Delays2
tIRD1
FO = 1 Routing Delay
2.0
2.2
2.5
2.9
4.1
ns
tIRD2
FO = 2 Routing Delay
2.3
2.6
2.9
3.4
4.8
ns
tIRD3
FO = 3 Routing Delay
2.6
2.9
3.3
3.9
5.5
ns
tIRD4
FO = 4 Routing Delay
3.0
3.3
3.8
4.4
6.2
ns
tIRD8
FO = 8 Routing Delay
4.3
4.8
5.5
6.4
9.0
ns
Table 1-38 A42MX36 Timing Characteristics (Nominal 5.0 V Operation)
(Worst-Case Commercial Conditions, VCCA = 4.75 V, TJ = 70掳C)
鈥�3 Speed
鈥�2 Speed
鈥�1 Speed
Std Speed
鈥揊 Speed
Parameter / Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max. Units
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input.
External setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an
external PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
鐩搁棞(gu膩n)PDF璩囨枡
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RSM36DSAI CONN EDGECARD 72POS R/A .156 SLD
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鍙冩暩(sh霉)鎻忚堪
A40MX04-VQ80A 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 6K 80-VQFP RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄e垪锛� 绯诲垪:MX 妯�(bi膩o)婧�(zh菙n)鍖呰:90 绯诲垪:ProASIC3 LAB/CLB鏁�(sh霉):- 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�(j矛):36864 杓稿叆/杓稿嚭鏁�(sh霉):157 闁€鏁�(sh霉):250000 闆绘簮闆诲:1.425 V ~ 1.575 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:-40°C ~ 125°C 灏佽/澶栨:256-LBGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:256-FPBGA锛�17x17锛�
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A40MX04-VQ80M 鍒堕€犲晢:Microsemi Corporation 鍔熻兘鎻忚堪:FPGA 6K GATES 547 CELLS 83MHZ/139MHZ 0.45UM 3.3V/5V 80VQFP - Trays 鍒堕€犲晢:Microsemi Corporation 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 6K 80-VQFP 鍒堕€犲晢:Microsemi Corporation 鍔熻兘鎻忚堪:IC FPGA 69 I/O 80VQFP
A40MX04-VQG80 鍔熻兘鎻忚堪:IC FPGA 69I/O 80VQFP RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄e垪锛� 绯诲垪:MX 妯�(bi膩o)婧�(zh菙n)鍖呰:24 绯诲垪:ECP2 LAB/CLB鏁�(sh霉):1500 閭忚集鍏冧欢/鍠厓鏁�(sh霉):12000 RAM 浣嶇附瑷�(j矛):226304 杓稿叆/杓稿嚭鏁�(sh霉):131 闁€鏁�(sh霉):- 闆绘簮闆诲:1.14 V ~ 1.26 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 85°C 灏佽/澶栨:208-BFQFP 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:208-PQFP锛�28x28锛�
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