- 鎮ㄧ従(xi脿n)鍦ㄧ殑浣嶇疆锛�璨疯常IC缍�(w菐ng) > PDF鐩寗4506 > A40MX04-PQ100 (Microsemi SoC)IC FPGA MX SGL CHIP 6K 100-PQFP PDF璩囨枡涓嬭級
鍙冩暩(sh霉)璩囨枡
| 鍨嬭櫉锛� | A40MX04-PQ100 |
| 寤犲晢锛� | Microsemi SoC |
| 鏂囦欢闋佹暩(sh霉)锛� | 103/142闋� |
| 鏂囦欢澶у皬锛� | 0K |
| 鎻忚堪锛� | IC FPGA MX SGL CHIP 6K 100-PQFP |
| 妯�(bi膩o)婧�(zh菙n)鍖呰锛� | 66 |
| 绯诲垪锛� | MX |
| 杓稿叆/杓稿嚭鏁�(sh霉)锛� | 69 |
| 闁€鏁�(sh霉)锛� | 6000 |
| 闆绘簮闆诲锛� | 3 V ~ 3.6 V锛�4.75 V ~ 5.25 V |
| 瀹夎椤炲瀷锛� | 琛ㄩ潰璨艰 |
| 宸ヤ綔婧害锛� | 0°C ~ 70°C |
| 灏佽/澶栨锛� | 100-BQFP |
| 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 | 100-PQFP锛�14x20锛� |
绗�1闋�绗�2闋�绗�3闋�绗�4闋�绗�5闋�绗�6闋�绗�7闋�绗�8闋�绗�9闋�绗�10闋�绗�11闋�绗�12闋�绗�13闋�绗�14闋�绗�15闋�绗�16闋�绗�17闋�绗�18闋�绗�19闋�绗�20闋�绗�21闋�绗�22闋�绗�23闋�绗�24闋�绗�25闋�绗�26闋�绗�27闋�绗�28闋�绗�29闋�绗�30闋�绗�31闋�绗�32闋�绗�33闋�绗�34闋�绗�35闋�绗�36闋�绗�37闋�绗�38闋�绗�39闋�绗�40闋�绗�41闋�绗�42闋�绗�43闋�绗�44闋�绗�45闋�绗�46闋�绗�47闋�绗�48闋�绗�49闋�绗�50闋�绗�51闋�绗�52闋�绗�53闋�绗�54闋�绗�55闋�绗�56闋�绗�57闋�绗�58闋�绗�59闋�绗�60闋�绗�61闋�绗�62闋�绗�63闋�绗�64闋�绗�65闋�绗�66闋�绗�67闋�绗�68闋�绗�69闋�绗�70闋�绗�71闋�绗�72闋�绗�73闋�绗�74闋�绗�75闋�绗�76闋�绗�77闋�绗�78闋�绗�79闋�绗�80闋�绗�81闋�绗�82闋�绗�83闋�绗�84闋�绗�85闋�绗�86闋�绗�87闋�绗�88闋�绗�89闋�绗�90闋�绗�91闋�绗�92闋�绗�93闋�绗�94闋�绗�95闋�绗�96闋�绗�97闋�绗�98闋�绗�99闋�绗�100闋�绗�101闋�绗�102闋�鐣�(d膩ng)鍓嶇103闋�绗�104闋�绗�105闋�绗�106闋�绗�107闋�绗�108闋�绗�109闋�绗�110闋�绗�111闋�绗�112闋�绗�113闋�绗�114闋�绗�115闋�绗�116闋�绗�117闋�绗�118闋�绗�119闋�绗�120闋�绗�121闋�绗�122闋�绗�123闋�绗�124闋�绗�125闋�绗�126闋�绗�127闋�绗�128闋�绗�129闋�绗�130闋�绗�131闋�绗�132闋�绗�133闋�绗�134闋�绗�135闋�绗�136闋�绗�137闋�绗�138闋�绗�139闋�绗�140闋�绗�141闋�绗�142闋�
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 59
CMOS Output Module Timing5
tDLH
Data-to-Pad HIGH
3.4
3.8
5.5
6.4
9.0
ns
tDHL
Data-to-Pad LOW
4.1
4.5
4.2
5.0
7.0
ns
tENZH
Enable Pad Z to HIGH
3.7
4.1
4.6
5.5
7.6
ns
tENZL
Enable Pad Z to LOW
4.1
4.5
5.1
6.1
8.5
ns
tENHZ
Enable Pad HIGH to Z
6.9
7.6
8.6
10.2
14.2
ns
tENLZ
Enable Pad LOW to Z
7.5
8.3
9.4
11.1
15.5
ns
tGLH
G-to-Pad HIGH
5.8
6.5
7.3
8.6
12.0
ns
tGHL
G-to-Pad LOW
5.8
6.5
7.3
8.6
12.0
ns
tLSU
I/O Latch Set-Up
0.7
0.8
0.9
1.0
1.4
ns
tLH
I/O Latch Hold
0.0
ns
tLCO
I/O Latch Clock-to-Out
(Pad-to-Pad), 64 Clock Loading
8.7
9.7
10.9
12.9
18.0
ns
tACO
Array Clock-to-Out
(Pad-to-Pad),
64 Clock Loading
12.2
13.5
15.4
18.1
25.3
ns
dTLH
Capacity Loading, LOW to HIGH
0.04
0.05
0.06
0.08 ns/pF
dTHL
Capacity Loading, HIGH to LOW
0.05
0.06
0.07
0.10 ns/pF
Table 1-33 A42MX09 Timing Characteristics (Nominal 3.3 V Operation) (continued)
(Worst-Case Commercial Conditions, VCCA = 3.0 V, TJ = 70掳C)
鈥�3 Speed
鈥�2 Speed
鈥�1 Speed
Std Speed
鈥揊 Speed
Units
Parameter / Description
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External
setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external
PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
鐩搁棞(gu膩n)PDF璩囨枡 |
PDF鎻忚堪 |
|---|---|
| A3P400-FG484 | IC FPGA 1KB FLASH 400K 484-FBGA |
| R1EX24512BTAS0A#S0 | IC EEPROM 512K 1MHZ 8TSSOP |
| ACM44DSXI | CONN EDGECARD 88POS DIP .156 SLD |
| ABM44DSXI | CONN EDGECARD 88POS DIP .156 SLD |
| ACM44DRXI | CONN EDGECARD 88POS DIP .156 SLD |
鐩搁棞(gu膩n)浠ｇ悊鍟�/鎶€琛�(sh霉)鍙冩暩(sh霉) |
鍙冩暩(sh霉)鎻忚堪 |
|---|---|
| A40MX04-PQ100A | 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 6K 100-PQFP RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄ｅ垪锛� 绯诲垪:MX 妯�(bi膩o)婧�(zh菙n)鍖呰:90 绯诲垪:ProASIC3 LAB/CLB鏁�(sh霉):- 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�(j矛):36864 杓稿叆/杓稿嚭鏁�(sh霉):157 闁€鏁�(sh霉):250000 闆绘簮闆诲:1.425 V ~ 1.575 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:-40°C ~ 125°C 灏佽/澶栨:256-LBGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:256-FPBGA锛�17x17锛� |
| A40MX04-PQ100ES | 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:40MX and 42MX FPGA Families |
| A40MX04-PQ100I | 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 6K 100-PQFP RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄ｅ垪锛� 绯诲垪:MX 妯�(bi膩o)婧�(zh菙n)鍖呰:90 绯诲垪:ProASIC3 LAB/CLB鏁�(sh霉):- 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�(j矛):36864 杓稿叆/杓稿嚭鏁�(sh霉):157 闁€鏁�(sh霉):250000 闆绘簮闆诲:1.425 V ~ 1.575 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:-40°C ~ 125°C 灏佽/澶栨:256-LBGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:256-FPBGA锛�17x17锛� |
| A40MX04-PQ100M | 鍒堕€犲晢:Microsemi Corporation 鍔熻兘鎻忚堪:FPGA 40MX Family 6K Gates 547 Cells 83MHz/139MHz 0.45um Technology 3.3V/5V 100-Pin PQFP 鍒堕€犲晢:Microsemi Corporation 鍔熻兘鎻忚堪:FPGA 6K GATES 547 CELLS 83MHZ/139MHZ 0.45UM 3.3V/5V 100PQFP - Trays 鍒堕€犲晢:Microsemi SOC Products Group 鍔熻兘鎻忚堪:83MHZ/139MHZ 0.45UM TECHNOLOGY 3.3V/5V 鍒堕€犲晢:Microsemi Corporation 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 6K 100-PQFP |
| A40MX04-PQ208A | 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:40MX and 42MX Automotive FPGA Families |
鐧�(f膩)甯冪穵鎬ラ噰璩硷紝3鍒嗛悩宸﹀彸鎮ㄥ皣寰楀埌鍥炲京(f霉)銆�
