• 參數(shù)資料
    型號(hào)： A40MX04-1PL44I
    元件分類： FPGA
    英文描述： FPGA, 547 CLBS, 6000 GATES, 92 MHz, PQCC44
    封裝： PLASTIC, LCC-44
    文件頁數(shù)： 46/124頁
    文件大?。?/td> 3142K
    代理商： A40MX04-1PL44I
    40MX and 42MX FPGA Families
    1- 22
    v6.1
    Junction Temperature (TJ)
    The temperature variable in the Designer software refers
    to
    the
    junction
    temperature,
    not
    the
    ambient
    temperature. This is an important distinction because the
    heat generated from dynamic power consumption is
    usually hotter than the ambient temperature. EQ 1-1,
    shown below, can be used to calculate junction
    temperature.
    EQ 1-1
    Junction Temperature =
    ΔT + T
    a(1)
    Where:
    Ta = Ambient Temperature
    ΔT = Temperature gradient between junction (silicon)
    and ambient
    ΔT = θ
    ja * P(2)
    P = Power
    θ
    ja = Junction to ambient of package. θja numbers are
    located in the Package Thermal Characteristics table
    below.
    Package Thermal Characteristics
    The device junction-to-case thermal characteristic is
    θ
    jc,
    and the junction-to-ambient air characteristic is
    θ
    ja. The
    thermal characteristics for
    θ
    ja are shown with two
    different air flow rates.
    The maximum junction temperature is 150
    °C.
    Maximum
    power
    dissipation
    for
    commercial-
    and
    industrial-grade devices is a function of θja.
    A sample calculation of the absolute maximum power
    dissipation allowed for a TQFP 176-pin package at
    commercial temperature and still air is as follow:
    The maximum power dissipation for military-grade devices is a function of θjc. A sample calculation of the absolute
    maximum power dissipation allowed for CQFP 208-pin package at military temperature and still air is as follows:
    Table 21
    Package Thermal Characteristics
    Plastic Packages
    Pin Count
    θ
    jc
    θ
    ja
    Units
    Still Air
    1.0 m/s
    200 ft/min.
    2.5 m/s
    500 ft/min.
    Plastic Quad Flat Pack
    100
    12.0
    27.8
    23.4
    21.2
    °C/W
    Plastic Quad Flat Pack
    160
    10.0
    26.2
    22.8
    21.1
    °C/W
    Plastic Quad Flat Pack
    208
    8.0
    26.1
    22.5
    20.8
    °C/W
    Plastic Quad Flat Pack
    240
    8.5
    25.6
    22.3
    20.8
    °C/W
    Plastic Leaded Chip Carrier
    44
    16.0
    20.0
    24.5
    22.0
    °C/W
    Plastic Leaded Chip Carrier
    68
    13.0
    25.0
    21.0
    19.4
    °C/W
    Plastic Leaded Chip Carrier
    84
    12.0
    22.5
    18.9
    17.6
    °C/W
    Thin Plastic Quad Flat Pack
    176
    11.0
    24.7
    19.9
    18.0
    °C/W
    Very Thin Plastic Quad Flat Pack
    80
    12.0
    38.2
    31.9
    29.4
    °C/W
    Very Thin Plastic Quad Flat Pack
    100
    10.0
    35.3
    29.4
    27.1
    °C/W
    Plastic Ball Grid Array
    272
    3.0
    18.3
    14.9
    13.9
    °C/W
    Ceramic Packages
    Ceramic Quad Flat Pack
    208
    2.0
    22.0
    19.8
    18.0
    °C/W
    Ceramic Quad Flat Pack
    256
    2.0
    20.0
    16.5
    15.0
    °C/W
    Maximum Power Allowed
    Max. junction temp. (
    °C) Max. ambient temp. (°C)
    –
    θ
    ja(°C/W)
    ---------------------------------------------------------------------------------------------------------------------------------
    150
    °C70°C
    –
    28
    °C/W
    -----------------------------------
    2.86W
    =
    Maximum Power Allowed
    Max. junction temp. (
    °C) Max. ambient temp. (°C)
    –
    θ
    jc(°C/W)
    ---------------------------------------------------------------------------------------------------------------------------------
    150
    °C 125°C
    –
    6.3
    °C/W
    --------------------------------------
    3.97W
    =
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    相關(guān)代理商/技術(shù)參數(shù)
    參數(shù)描述
    A40MX04-1PL44M 制造商:Microsemi Corporation 功能描述:FPGA 6K GATES 547 CELLS 96MHZ/160MHZ 0.45UM 3.3V/5V 44PLCC - Rail/Tube 制造商:Microsemi Corporation 功能描述:IC FPGA 34 I/O 44PLCC 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 6K 44-PLCC
    A40MX04-1PL44MX130 制造商:Microsemi Corporation 功能描述:FPGA 6K GATES 547 CELLS 96MHZ/160MHZ 0.45UM 3.3V/5V 44PLCC - Rail/Tube
    A40MX04-1PL44MX3 制造商:Microsemi Corporation 功能描述:FPGA 6K GATES 547 CELLS 96MHZ/160MHZ 0.45UM 3.3V/5V 44PLCC - Rail/Tube
    A40MX04-1PL68 功能描述:IC FPGA MX SGL CHIP 6K 68-PLCC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
    A40MX04-1PL68I 功能描述:IC FPGA MX SGL CHIP 6K 68-PLCC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
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