參數(shù)資料
型號(hào): A40MX02-1PQ100I
廠商: Microsemi SoC
文件頁數(shù): 13/142頁
文件大?。?/td> 0K
描述: IC FPGA MX SGL CHIP 3K 100-PQFP
標(biāo)準(zhǔn)包裝: 66
系列: MX
輸入/輸出數(shù): 57
門數(shù): 3000
電源電壓: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 100-BQFP
供應(yīng)商設(shè)備封裝: 100-PQFP(14x20)
40MX and 42MX FPGA Families
Re vi s i on 11
1-7
MultiPlex I/O Modules
42MX devices feature Multiplex I/Os and support 5.0V, 3.3V, and mixed 3.3V/5.0V operations.
The MultiPlex I/O modules provide the interface between the device pins and the logic array. Figure 1-9
is a block diagram of the 42MX I/O module. A variety of user functions, determined by a library macro
selection, can be implemented in the module. (Refer to the Antifuse Macro Library Guide for more
information.) All 42MX I/O modules contain tristate buffers, with input and output latches that can be
configured for input, output, or bidirectional operation.
All 42MX devices contain flexible I/O structures, where each output pin has a dedicated output-enable
control (Figure 1-9). The I/O module can be used to latch input or output data, or both, providing fast set-
up time. In addition, the Designer software tools can build a D-type flip-flop using a C-module combined
with an I/O module to register input and output signals. Refer to the Antifuse Macro Library Guide for
more details.
A42MX24 and A42MX36 devices also offer selectable PCI output drives, enabling 100% compliance with
version 2.1 of the PCI specification. For low-power systems, all inputs and outputs are turned off to
reduce current consumption to below 500
μA.
To achieve 5.0V or 3.3V PCI-compliant output drives on A42MX24 and A42MX36 devices, a chip-wide
PCI fuse is programmed via the Device Selection Wizard in the Designer software (Figure 1-10). When
the PCI fuse is not programmed, the output drive is standard.
Designer software development tools provide a design library of I/O macro functions that can implement
all I/O configurations supported by the MX FPGAs.
Note:
*Can be configured as a Latch or D Flip-Flop (Using
C-Module)
Figure 1-9
42MX I/O Module
Figure 1-10 PCI Output Structure of A42MX24 and A42MX36 Devices
Q
D
From Array
To Array
G/CLK*
Q
D
PAD
EN
Signal
PCI Enable
PCI
Fuse
Drive
STD
Output
相關(guān)PDF資料
PDF描述
GSC65DRYI CONN EDGECARD 130PS DIP .100 SLD
GMC65DRYI CONN EDGECARD 130PS DIP .100 SLD
ACM43DTKI CONN EDGECARD 86POS DIP .156 SLD
ASM36DSEF-S13 CONN EDGECARD 72POS .156 EXTEND
AMM36DSEF-S13 CONN EDGECARD 72POS .156 EXTEND
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A40MX02-1PQ100M 制造商:Microsemi Corporation 功能描述:FPGA 40MX Family 3K Gates 295 Cells 96MHz/160MHz 0.45um Technology 3.3V/5V 100-Pin PQFP 制造商:Microsemi Corporation 功能描述:FPGA 3K GATES 295 CELLS 96MHZ/160MHZ 0.45UM 3.3V/5V 100PQFP - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 3K 100-PQFP
A40MX02-1PQG100 功能描述:IC FPGA MX SGL CHIP 3K 100-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A40MX02-1PQG100I 功能描述:IC FPGA MX SGL CHIP 3K 100-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A40MX02-1PQG100M 制造商:Microsemi Corporation 功能描述:FPGA 3K GATES 295 CELLS 96MHZ/160MHZ 0.45UM 3.3V/5V 100PQFP - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 57 I/O 100PQFP
A40MX02-1VQ80 功能描述:IC FPGA MX SGL CHIP 3K 80-VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)