Revision 11 5-5 Revision 1 (cont’d) The device architecture figures, Figure 1-3 ProASIC3 nano Device Architecture Overv" />
參數資料
型號: A3PN060-2VQG100I
廠商: Microsemi SoC
文件頁數: 15/114頁
文件大小: 0K
描述: IC FPGA NANO 60K GATES 100-VQFP
標準包裝: 90
系列: ProASIC3 nano
RAM 位總計: 18432
輸入/輸出數: 71
門數: 60000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 100-TQFP
供應商設備封裝: 100-VQFP(14x14)
ProASIC3 nano Flash FPGAs
Revision 11
5-5
Revision 1 (cont’d)
The device architecture figures, Figure 1-3 ProASIC3 nano Device Architecture
through
The "PLL and CCC" section was revised to include information about CCC-GLs in
A3PN020 and smaller devices.
DC and Switching
Characteristics
Advance v0.2
the VCCI row. The following table note was added: "VMV pins must be connected
to the corresponding VCCI pins."
for A3PN010, A3PN015, and A3PN020.
A table note, "All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide
range, as specified in the JESD8-B specification," was added to Table 2-14
3.3 V LVCMOS Wide Range was added to Table 2-21 I/O Output Buffer
Packaging Advance
v0.2
The "48-Pin QFN" pin diagram was revised.
Note 2 for the "48-Pin QFN", "68-Pin QFN", and "100-Pin VQFP" pin diagrams
was added/changed to "The die attach paddle of the package is tied to ground
(GND)."
The "100-Pin VQFP" pin diagram was revised to move the pin IDs to the upper
left corner instead of the upper right corner.
Revision
Changes
Page
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相關代理商/技術參數
參數描述
A3PN060-DIELOT 制造商:Microsemi Corporation 功能描述:A3PN060-DIELOT - Gel-pak, waffle pack, wafer, diced wafer on film
A3PN060-VQ100 功能描述:IC FPGA NANO 60K GATES 100-VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:ProASIC3 nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數:- 邏輯元件/單元數:792 RAM 位總計:- 輸入/輸出數:120 門數:30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)
A3PN060-VQ100I 功能描述:IC FPGA NANO 60K GATES 100-VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:ProASIC3 nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數:- 邏輯元件/單元數:792 RAM 位總計:- 輸入/輸出數:120 門數:30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)
A3PN060-VQG100 功能描述:IC FPGA NANO 512MAC 100VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:ProASIC3 nano 標準包裝:60 系列:XP LAB/CLB數:- 邏輯元件/單元數:10000 RAM 位總計:221184 輸入/輸出數:244 門數:- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應商設備封裝:388-FPBGA(23x23) 其它名稱:220-1241
A3PN060-VQG100I 功能描述:IC FPGA NANO 60K GATES 100-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:ProASIC3 nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數:- 邏輯元件/單元數:792 RAM 位總計:- 輸入/輸出數:120 門數:30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)