參數(shù)資料
型號: A3PN020-QNG68
廠商: Microsemi SoC
文件頁數(shù): 3/27頁
文件大小: 0K
描述: IC FPGA NANO 172MAC 68QFN
標準包裝: 260
系列: ProASIC3 nano
輸入/輸出數(shù): 49
門數(shù): 20000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 68-VFQFN 裸露焊盤
供應商設備封裝: 68-QFN(8x8)
其它名稱: 1100-1039
11
www.microsemi.com/soc
ProASIC3
ProASIC3 nano
The lowest-cost solution with enhanced I/O capabilities
Microsemi’s innovative ProASIC3 nano devices bring a new level of value and flexibility to high-volume markets. When measured against the typical project
metrics of performance, cost, flexibility and time-to-market, ProASIC3 nano devices provide an attractive alternative to ASICs and ASSPs in fast moving or highly
competitive markets. Customer-driven total system cost reduction was a key design criterium for the ProASIC3 nano program. Reduced device cost, availability of
known good die, a single-chip implementation and a broad selection of small footprint packages all contribute to lower total system costs.
1.5Vcoreforlowpower
Knowngooddiesupported
350MHzsystemperformance
EmbeddedSRAMNVM
Configurationmemoryerrorimmune
Enhancedcommercialtemperature
EnhancedI/Ofeatures
ISPandsecurity
Reprogrammableflashtechnology
Zerolead-timeonselecteddevices
CCCsandPLLs
I/Os Per Package
ProASIC3 nano Devices
A3PN010
A3PN020
A3PN060
A3PN125
A3PN250
System Gates
10,000
20,000
60,000
125,000
250,000
Typical Equivalent Macrocells
86
172
512
1,024
2,048
VersaTiles(D-flip-flops)
260
520
1,536
3,072
6,144
RAM1(1,024bits)
18
36
4,608-BitBlocks1
4
8
FlashROMKbits(1,024bits)
1
AES-Protected ISP1
Yes
Integrated PLL in CCCs1
1
VersaNetGlobals
4
18
I/OBanks
2
3
2
4
Maximum User I/Os (packaged device)
34
49
71
68
Known Good Die User I/Os
34
52
71
68
Package Pin
QN
VQ
QN48
QN68
VQ100
ProASIC3 nano Devices
A3PN010
A3PN020
A3PN060
A3PN125
A3PN250
Known Good Die
34
52
71
68
QN48
34
QN68
49
VQ100
71
68
Notes:
1. A3PN030 and smaller devices do not support this feature.
2. For higher densities and support of additional features, refer to the ProASIC3 and ProASIC3E datasheets and FPGA fabric user’s guides.
相關PDF資料
PDF描述
CS5203A-5GT3 IC REG LDO 5V 3A TO220AB
ADM1021ARQ IC SENSOR TEMP DUAL3/5.5V 16QSOP
ADM1021AARQ-REEL7 IC SENSOR TEMP DUAL3/5.5V 16QSOP
ADM1021AARQ-REEL IC SENSOR TEMP DUAL3/5.5V 16QSOP
ADM1021AARQ IC SENSOR TEMP DUAL3/5.5V 16QSOP
相關代理商/技術參數(shù)
參數(shù)描述
A3PN020-QNG68I 功能描述:IC FPGA NANO 20K GATES 68-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3 nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)
A3PN030-VQG100 制造商:Microsemi Corporation 功能描述:FPGA PROASIC3 NANO 30K GATES 130NM 1.5V - Trays
A3PN030-Z1QNG48 功能描述:IC FPGA NANO 30K GATES 48-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3 nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)
A3PN030-Z1QNG48I 功能描述:IC FPGA NANO 30K GATES 48-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3 nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)
A3PN030-Z1QNG68 功能描述:IC FPGA NANO 30K GATES 68-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3 nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)