
January 2013
I
 2013 Microsemi Corporation
ProASIC3L Low Power Flash FPGAs
with Flash*Freeze Technology
Features and Benefits
Low Power
 Dramatic Reduction in Dynamic and Static Power Savings
 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power
 Low Power Consumption in Flash*Freeze Mode Allows for
Instantaneous Entry to / Exit from Low-Power Flash*Freeze
Mode
 Supports Single-Voltage System Operation
 Low-Impedance Switches
High Capacity
 250,000 to 3,000,000 System Gates
 Up to 504 kbits of True Dual-Port SRAM
 Up to 620 User I/Os
Reprogrammable Flash Technology
 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
 Instant On Level 0 Support
 Single-Chip Solution
 Retains Programmed Design when Powered Off
High Performance
 350 MHz (1.5 V systems) and 250 MHz (1.2 V systems) System
Performance
 3.3 V, 66 MHz, 66-Bit PCI (1.5 V systems) and 66 MHz, 32-Bit
PCI (1.2 V systems)
In-System Programming (ISP) and Security
 ISP Using On-Chip 128-Bit Advanced Encryption Standard
(AES) Decryption via JTAG (IEEE 1532–compliant)
 FlashLock to Secure FPGA Contents
High-Performance Routing Hierarchy
 Segmented, Hierarchical Routing and Clock Structure
 High-Performance, Low-Skew Global Network
 Architecture Supports Ultra-High Utilization
Advanced and Pro (Professional) I/Os
 700 Mbps DDR, LVDS-Capable I/Os
 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
 Bank-Selectable I/O Voltages—up to 8 Banks per Chip
 Single-Ended
I/O
Standards:
LVTTL,
LVCMOS
3.3 V /
2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X, and
LVCMOS 2.5 V / 5.0 V Input
 Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
M-LVDS
 Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL
2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3
Class I and II (A3PE3000L only)
 Wide Range Power Supply Voltage Support per JESD8-B,
Allowing I/Os to Operate from 2.7 V to 3.6 V
 Wide Range Power Supply Voltage Support per JESD8-12,
Allowing I/Os to Operate from 1.14 V to 1.575 V
 I/O Registers on Input, Output, and Enable Paths
 Hot-Swappable and Cold-Sparing I/Os Programmable Output
Slew Rate and Drive Strength
 Programmable Input Delay (A3PE3000L only)
 Schmitt Trigger Option on Single-Ended Inputs (A3PE3000L)
 Weak Pull-Up/-Down
 IEEE 1149.1 (JTAG) Boundary Scan Test
 Pin-Compatible Packages across the ProASIC3L Family
(except PQ208)
Clock Conditioning Circuit (CCC) and PLL
 Six CCC Blocks, One with Integrated PLL (ProASIC3L) and All
with Integrated PLL (ProASIC3EL)
 Configurable Phase Shift, Multiply/Divide, Delay Capabilities,
and External Feedback
 Wide Input Frequency Range 1.5 MHz to 250 MHz (1.2 V
systems) and 350 MHz (1.5 V systems))
SRAMs and FIFOs
 Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,
and ×18 organizations available)
 True Dual-Port SRAM (except ×18)
 24 SRAM and FIFO Configurations with Synchronous
Operation:
– 250 MHz: For 1.2 V systems
– 350 MHz: For 1.5 V systems
ARM Processor Support in ProASIC3L FPGAs
 ARM Cortex-M1 Soft Processor Available with or without
Debug
Table 1  ProASIC3 Low-Power Product Family
ProASIC3L Devices
A3P250L
A3P600L
A3P1000L
A3PE3000L
ARM Cortex-M1
Devices 1
M1A3P600L
M1A3P1000L
M1A3PE3000L
System Gates
250,000
600,000
1,000,000
3,000,000
VersaTiles (D-flip-flops)
6,144
13,824
24,576
75,264
RAM Kbits (1,024 bits)
36
108
144
504
4,608-Bit Blocks
824
32
112
FlashROM Kbits
111
1
Secure (AES) ISP 2
Yes
Integrated PLL in CCCs 3
111
6
VersaNet Globals
18
I/O Banks
444
8
Maximum User I/Os
157
235
300
620
Package Pins
VQFP
PQFP
FBGA
VQ100
PQ208
FG144, FG256
PQ208
FG144, FG256, FG484
PQ208
FG144, FG256, FG484
PQ208 3
FG324, FG484, FG896
Notes:
1. Refer to the Cortex-M1 product brief for more information. 2. AES is not available for ARM Cortex-M1 ProASIC3L devices.
3. For the A3PE3000L, the PQ208 package has six CCCs and two PLLs.
Revision 13