- 鎮ㄧ従(xi脿n)鍦ㄧ殑浣嶇疆锛�璨疯常IC缍�(w菐ng) > PDF鐩寗4488 > A3P600-FGG144I (Microsemi SoC)IC FPGA 1KB FLASH 600K 144-FBGA PDF璩囨枡涓嬭級
鍙冩暩(sh霉)璩囨枡
| 鍨嬭櫉(h脿o)锛� | A3P600-FGG144I |
| 寤犲晢锛� | Microsemi SoC |
| 鏂囦欢闋佹暩(sh霉)锛� | 90/220闋� |
| 鏂囦欢澶�?銆�?/td> | 0K |
| 鎻忚堪锛� | IC FPGA 1KB FLASH 600K 144-FBGA |
| 妯�(bi膩o)婧�(zh菙n)鍖呰锛� | 160 |
| 绯诲垪锛� | ProASIC3 |
| RAM 浣嶇附瑷�(j矛)锛� | 110592 |
| 杓稿叆/杓稿嚭鏁�(sh霉)锛� | 97 |
| 闁€鏁�(sh霉)锛� | 600000 |
| 闆绘簮闆诲锛� | 1.425 V ~ 1.575 V |
| 瀹夎椤炲瀷锛� | 琛ㄩ潰璨艰 |
| 宸ヤ綔婧害锛� | -40°C ~ 85°C |
| 灏佽/澶栨锛� | 144-LBGA |
| 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 | 144-FPBGA锛�13x13锛� |
绗�1闋�绗�2闋�绗�3闋�绗�4闋�绗�5闋�绗�6闋�绗�7闋�绗�8闋�绗�9闋�绗�10闋�绗�11闋�绗�12闋�绗�13闋�绗�14闋�绗�15闋�绗�16闋�绗�17闋�绗�18闋�绗�19闋�绗�20闋�绗�21闋�绗�22闋�绗�23闋�绗�24闋�绗�25闋�绗�26闋�绗�27闋�绗�28闋�绗�29闋�绗�30闋�绗�31闋�绗�32闋�绗�33闋�绗�34闋�绗�35闋�绗�36闋�绗�37闋�绗�38闋�绗�39闋�绗�40闋�绗�41闋�绗�42闋�绗�43闋�绗�44闋�绗�45闋�绗�46闋�绗�47闋�绗�48闋�绗�49闋�绗�50闋�绗�51闋�绗�52闋�绗�53闋�绗�54闋�绗�55闋�绗�56闋�绗�57闋�绗�58闋�绗�59闋�绗�60闋�绗�61闋�绗�62闋�绗�63闋�绗�64闋�绗�65闋�绗�66闋�绗�67闋�绗�68闋�绗�69闋�绗�70闋�绗�71闋�绗�72闋�绗�73闋�绗�74闋�绗�75闋�绗�76闋�绗�77闋�绗�78闋�绗�79闋�绗�80闋�绗�81闋�绗�82闋�绗�83闋�绗�84闋�绗�85闋�绗�86闋�绗�87闋�绗�88闋�绗�89闋�鐣�(d膩ng)鍓嶇90闋�绗�91闋�绗�92闋�绗�93闋�绗�94闋�绗�95闋�绗�96闋�绗�97闋�绗�98闋�绗�99闋�绗�100闋�绗�101闋�绗�102闋�绗�103闋�绗�104闋�绗�105闋�绗�106闋�绗�107闋�绗�108闋�绗�109闋�绗�110闋�绗�111闋�绗�112闋�绗�113闋�绗�114闋�绗�115闋�绗�116闋�绗�117闋�绗�118闋�绗�119闋�绗�120闋�绗�121闋�绗�122闋�绗�123闋�绗�124闋�绗�125闋�绗�126闋�绗�127闋�绗�128闋�绗�129闋�绗�130闋�绗�131闋�绗�132闋�绗�133闋�绗�134闋�绗�135闋�绗�136闋�绗�137闋�绗�138闋�绗�139闋�绗�140闋�绗�141闋�绗�142闋�绗�143闋�绗�144闋�绗�145闋�绗�146闋�绗�147闋�绗�148闋�绗�149闋�绗�150闋�绗�151闋�绗�152闋�绗�153闋�绗�154闋�绗�155闋�绗�156闋�绗�157闋�绗�158闋�绗�159闋�绗�160闋�绗�161闋�绗�162闋�绗�163闋�绗�164闋�绗�165闋�绗�166闋�绗�167闋�绗�168闋�绗�169闋�绗�170闋�绗�171闋�绗�172闋�绗�173闋�绗�174闋�绗�175闋�绗�176闋�绗�177闋�绗�178闋�绗�179闋�绗�180闋�绗�181闋�绗�182闋�绗�183闋�绗�184闋�绗�185闋�绗�186闋�绗�187闋�绗�188闋�绗�189闋�绗�190闋�绗�191闋�绗�192闋�绗�193闋�绗�194闋�绗�195闋�绗�196闋�绗�197闋�绗�198闋�绗�199闋�绗�200闋�绗�201闋�绗�202闋�绗�203闋�绗�204闋�绗�205闋�绗�206闋�绗�207闋�绗�208闋�绗�209闋�绗�210闋�绗�211闋�绗�212闋�绗�213闋�绗�214闋�绗�215闋�绗�216闋�绗�217闋�绗�218闋�绗�219闋�绗�220闋�
ProASIC3 DC and Switching Characteristics
2-4
Revision 13
Internal Power-Up Activation Sequence
1. Core
2. Input buffers
Output buffers, after 200 ns delay from input buffer activation
Thermal Characteristics
Introduction
The temperature variable in the Microsemi Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction to be higher than the ambient temperature.
EQ 1 can be used to calculate junction temperature.
TJ = Junction Temperature = T + TA
EQ 1
where:
TA = Ambient Temperature
T = Temperature gradient between junction (silicon) and ambient T = ja * P
P = Power dissipation
Figure 2-1 I/O State as a Function of VCCI and VCC Voltage Levels
Region 1: I/O buffers are OFF
Region 2: I/O buffers are ON.
I/Os are functional (except differential inputs)
but slower because VCCI / VCC are below
specification. For the same reason, input
buffers do not meet VIH / VIL levels, and
output buffers do not meet VOH / VOL levels.
Min VCCI datasheet specification
voltage at a selected I/O
standard; i.e., 1.425 V or 1.7 V
or 2.3 V or 3.0 V
VCC
VCC = 1.425 V
Region 1: I/O Buffers are OFF
Activation trip point:
Va = 0.85 V 卤 0.25 V
Deactivation trip point:
Vd = 0.75 V 卤 0.25 V
Activation trip point:
Va = 0.9 V 卤 0.3 V
Deactivation trip point:
Vd = 0.8 V 卤 0.3 V
VCC = 1.575 V
Region 5: I/O buffers are ON
and power supplies are within
specification.
I/Os meet the entire datasheet
and timer specifications for
speed, VIH / VIL, VOH / VOL,
etc.
Region 4: I/O
buffers are ON.
I/Os are functional
(except differential
but slower because VCCI
is below specification. For the
same reason, input buffers do not
meet VIH / VIL levels, and output
buffers do not meet VOH / VOL levels.
where VT can be from 0.58 V to 0.9 V (typically 0.75 V)
VCCI
Region 3: I/O buffers are ON.
I/Os are functional; I/O DC
specifications are met,
but I/Os are slower because
the VCC is below specification.
VCC = VCCI + VT
鐩搁棞(gu膩n)PDF璩囨枡 |
PDF鎻忚堪 |
|---|---|
| HSM44DRKN | CONN EDGECARD 88POS DIP .156 SLD |
| M1A3P600-FGG144I | IC FPGA 1KB FLASH 600K 144-FBGA |
| HSM44DRKH | CONN EDGECARD 88POS DIP .156 SLD |
| M1A3P1000-1FG144 | IC FPGA M1 1KB FLASH 1M 144FBGA |
| A3P1000-1FGG144 | IC FPGA 1KB FLASH 1M 144-FBGA |
鐩搁棞(gu膩n)浠ｇ悊鍟�/鎶€琛�(sh霉)鍙冩暩(sh霉) |
鍙冩暩(sh霉)鎻忚堪 |
|---|---|
| A3P600-FGG144PP | 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:ProASIC3 Flash Family FPGAs |
| A3P600-FGG256 | 鍔熻兘鎻忚堪:IC FPGA 1KB FLASH 600K 256-FBGA RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫�(ch菐ng)鍙法绋嬮杸闄ｅ垪锛� 绯诲垪:ProASIC3 妯�(bi膩o)婧�(zh菙n)鍖呰:90 绯诲垪:ProASIC3 LAB/CLB鏁�(sh霉):- 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�(j矛):36864 杓稿叆/杓稿嚭鏁�(sh霉):157 闁€鏁�(sh霉):250000 闆绘簮闆诲:1.425 V ~ 1.575 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:-40°C ~ 125°C 灏佽/澶栨:256-LBGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:256-FPBGA锛�17x17锛� |
| A3P600-FGG256I | 鍔熻兘鎻忚堪:IC FPGA 1KB FLASH 600K 256-FBGA RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫�(ch菐ng)鍙法绋嬮杸闄ｅ垪锛� 绯诲垪:ProASIC3 妯�(bi膩o)婧�(zh菙n)鍖呰:90 绯诲垪:ProASIC3 LAB/CLB鏁�(sh霉):- 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�(j矛):36864 杓稿叆/杓稿嚭鏁�(sh霉):157 闁€鏁�(sh霉):250000 闆绘簮闆诲:1.425 V ~ 1.575 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:-40°C ~ 125°C 灏佽/澶栨:256-LBGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:256-FPBGA锛�17x17锛� |
| A3P600-FGG484 | 鍔熻兘鎻忚堪:IC FPGA 235I/O 484FBGA RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫�(ch菐ng)鍙法绋嬮杸闄ｅ垪锛� 绯诲垪:ProASIC3 妯�(bi膩o)婧�(zh菙n)鍖呰:24 绯诲垪:ECP2 LAB/CLB鏁�(sh霉):1500 閭忚集鍏冧欢/鍠厓鏁�(sh霉):12000 RAM 浣嶇附瑷�(j矛):226304 杓稿叆/杓稿嚭鏁�(sh霉):131 闁€鏁�(sh霉):- 闆绘簮闆诲:1.14 V ~ 1.26 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 85°C 灏佽/澶栨:208-BFQFP 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:208-PQFP锛�28x28锛� |
| A3P600-FGG484I | 鍔熻兘鎻忚堪:IC FPGA 1KB FLASH 600K 484-FBGA RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫�(ch菐ng)鍙法绋嬮杸闄ｅ垪锛� 绯诲垪:ProASIC3 妯�(bi膩o)婧�(zh菙n)鍖呰:40 绯诲垪:SX-A LAB/CLB鏁�(sh霉):6036 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�(j矛):- 杓稿叆/杓稿嚭鏁�(sh霉):360 闁€鏁�(sh霉):108000 闆绘簮闆诲:2.25 V ~ 5.25 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 70°C 灏佽/澶栨:484-BGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:484-FPBGA锛�27X27锛� |
鐧�(f膩)甯冪穵鎬ラ噰璩�锛�3鍒嗛悩宸﹀彸鎮ㄥ皣寰楀埌鍥炲京(f霉)銆�
