2-4 Revision 13 Internal Power-Up Activation Sequence 1. Core 2. Input buffers Output buffers, af" />
鍙冩暩(sh霉)璩囨枡
鍨嬭櫉锛� A3P600-2FG484
寤犲晢锛� Microsemi SoC
鏂囦欢闋佹暩(sh霉)锛� 90/220闋�
鏂囦欢澶�?銆�?/td> 0K
鎻忚堪锛� IC FPGA 1KB FLASH 600K 484-FBGA
妯�(bi膩o)婧�(zh菙n)鍖呰锛� 40
绯诲垪锛� ProASIC3
RAM 浣嶇附瑷堬細 110592
杓稿叆/杓稿嚭鏁�(sh霉)锛� 235
闁€鏁�(sh霉)锛� 600000
闆绘簮闆诲锛� 1.425 V ~ 1.575 V
瀹夎椤炲瀷锛� 琛ㄩ潰璨艰
宸ヤ綔婧害锛� 0°C ~ 70°C
灏佽/澶栨锛� 484-BGA
渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 484-FPBGA锛�23x23锛�
绗�1闋�绗�2闋�绗�3闋�绗�4闋�绗�5闋�绗�6闋�绗�7闋�绗�8闋�绗�9闋�绗�10闋�绗�11闋�绗�12闋�绗�13闋�绗�14闋�绗�15闋�绗�16闋�绗�17闋�绗�18闋�绗�19闋�绗�20闋�绗�21闋�绗�22闋�绗�23闋�绗�24闋�绗�25闋�绗�26闋�绗�27闋�绗�28闋�绗�29闋�绗�30闋�绗�31闋�绗�32闋�绗�33闋�绗�34闋�绗�35闋�绗�36闋�绗�37闋�绗�38闋�绗�39闋�绗�40闋�绗�41闋�绗�42闋�绗�43闋�绗�44闋�绗�45闋�绗�46闋�绗�47闋�绗�48闋�绗�49闋�绗�50闋�绗�51闋�绗�52闋�绗�53闋�绗�54闋�绗�55闋�绗�56闋�绗�57闋�绗�58闋�绗�59闋�绗�60闋�绗�61闋�绗�62闋�绗�63闋�绗�64闋�绗�65闋�绗�66闋�绗�67闋�绗�68闋�绗�69闋�绗�70闋�绗�71闋�绗�72闋�绗�73闋�绗�74闋�绗�75闋�绗�76闋�绗�77闋�绗�78闋�绗�79闋�绗�80闋�绗�81闋�绗�82闋�绗�83闋�绗�84闋�绗�85闋�绗�86闋�绗�87闋�绗�88闋�绗�89闋�鐣�(d膩ng)鍓嶇90闋�绗�91闋�绗�92闋�绗�93闋�绗�94闋�绗�95闋�绗�96闋�绗�97闋�绗�98闋�绗�99闋�绗�100闋�绗�101闋�绗�102闋�绗�103闋�绗�104闋�绗�105闋�绗�106闋�绗�107闋�绗�108闋�绗�109闋�绗�110闋�绗�111闋�绗�112闋�绗�113闋�绗�114闋�绗�115闋�绗�116闋�绗�117闋�绗�118闋�绗�119闋�绗�120闋�绗�121闋�绗�122闋�绗�123闋�绗�124闋�绗�125闋�绗�126闋�绗�127闋�绗�128闋�绗�129闋�绗�130闋�绗�131闋�绗�132闋�绗�133闋�绗�134闋�绗�135闋�绗�136闋�绗�137闋�绗�138闋�绗�139闋�绗�140闋�绗�141闋�绗�142闋�绗�143闋�绗�144闋�绗�145闋�绗�146闋�绗�147闋�绗�148闋�绗�149闋�绗�150闋�绗�151闋�绗�152闋�绗�153闋�绗�154闋�绗�155闋�绗�156闋�绗�157闋�绗�158闋�绗�159闋�绗�160闋�绗�161闋�绗�162闋�绗�163闋�绗�164闋�绗�165闋�绗�166闋�绗�167闋�绗�168闋�绗�169闋�绗�170闋�绗�171闋�绗�172闋�绗�173闋�绗�174闋�绗�175闋�绗�176闋�绗�177闋�绗�178闋�绗�179闋�绗�180闋�绗�181闋�绗�182闋�绗�183闋�绗�184闋�绗�185闋�绗�186闋�绗�187闋�绗�188闋�绗�189闋�绗�190闋�绗�191闋�绗�192闋�绗�193闋�绗�194闋�绗�195闋�绗�196闋�绗�197闋�绗�198闋�绗�199闋�绗�200闋�绗�201闋�绗�202闋�绗�203闋�绗�204闋�绗�205闋�绗�206闋�绗�207闋�绗�208闋�绗�209闋�绗�210闋�绗�211闋�绗�212闋�绗�213闋�绗�214闋�绗�215闋�绗�216闋�绗�217闋�绗�218闋�绗�219闋�绗�220闋�
ProASIC3 DC and Switching Characteristics
2-4
Revision 13
Internal Power-Up Activation Sequence
1. Core
2. Input buffers
Output buffers, after 200 ns delay from input buffer activation
Thermal Characteristics
Introduction
The temperature variable in the Microsemi Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction to be higher than the ambient temperature.
EQ 1 can be used to calculate junction temperature.
TJ = Junction Temperature = T + TA
EQ 1
where:
TA = Ambient Temperature
T = Temperature gradient between junction (silicon) and ambient T = ja * P
ja = Junction-to-ambient of the package. ja numbers are located in Table 2-5.
P = Power dissipation
Figure 2-1 I/O State as a Function of VCCI and VCC Voltage Levels
Region 1: I/O buffers are OFF
Region 2: I/O buffers are ON.
I/Os are functional (except differential inputs)
but slower because VCCI / VCC are below
specification. For the same reason, input
buffers do not meet VIH / VIL levels, and
output buffers do not meet VOH / VOL levels.
Min VCCI datasheet specification
voltage at a selected I/O
standard; i.e., 1.425 V or 1.7 V
or 2.3 V or 3.0 V
VCC
VCC = 1.425 V
Region 1: I/O Buffers are OFF
Activation trip point:
Va = 0.85 V 卤 0.25 V
Deactivation trip point:
Vd = 0.75 V 卤 0.25 V
Activation trip point:
Va = 0.9 V 卤 0.3 V
Deactivation trip point:
Vd = 0.8 V 卤 0.3 V
VCC = 1.575 V
Region 5: I/O buffers are ON
and power supplies are within
specification.
I/Os meet the entire datasheet
and timer specifications for
speed, VIH / VIL, VOH / VOL,
etc.
Region 4: I/O
buffers are ON.
I/Os are functional
(except differential
but slower because VCCI
is below specification. For the
same reason, input buffers do not
meet VIH / VIL levels, and output
buffers do not meet VOH / VOL levels.
where VT can be from 0.58 V to 0.9 V (typically 0.75 V)
VCCI
Region 3: I/O buffers are ON.
I/Os are functional; I/O DC
specifications are met,
but I/Os are slower because
the VCC is below specification.
VCC = VCCI + VT
鐩搁棞(gu膩n)PDF璩囨枡
PDF鎻忚堪
A3P600-2FGG484 IC FPGA 1KB FLASH 600K 484-FBGA
RMM44DRKH-S13 CONN EDGECARD 88POS .156 EXTEND
RSM44DRYS CONN EDGECARD 88POS DIP .156 SLD
RMM44DRYS CONN EDGECARD 88POS DIP .156 SLD
ASM36DRYN CONN EDGECARD 72POS DIP .156 SLD
鐩搁棞(gu膩n)浠g悊鍟�/鎶€琛�(sh霉)鍙冩暩(sh霉)
鍙冩暩(sh霉)鎻忚堪
A3P600-2FG484I 鍔熻兘鎻忚堪:IC FPGA 1KB FLASH 600K 484-FBGA RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄e垪锛� 绯诲垪:ProASIC3 妯�(bi膩o)婧�(zh菙n)鍖呰:40 绯诲垪:SX-A LAB/CLB鏁�(sh霉):6036 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�:- 杓稿叆/杓稿嚭鏁�(sh霉):360 闁€鏁�(sh霉):108000 闆绘簮闆诲:2.25 V ~ 5.25 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 70°C 灏佽/澶栨:484-BGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:484-FPBGA锛�27X27锛�
A3P600-2FGG144 鍔熻兘鎻忚堪:IC FPGA 1KB FLASH 600K 144-FBGA RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄e垪锛� 绯诲垪:ProASIC3 妯�(bi膩o)婧�(zh菙n)鍖呰:90 绯诲垪:ProASIC3 LAB/CLB鏁�(sh霉):- 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�:36864 杓稿叆/杓稿嚭鏁�(sh霉):157 闁€鏁�(sh霉):250000 闆绘簮闆诲:1.425 V ~ 1.575 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:-40°C ~ 125°C 灏佽/澶栨:256-LBGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:256-FPBGA锛�17x17锛�
A3P600-2FGG144ES 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:ProASIC3 Flash Family FPGAs
A3P600-2FGG144I 鍔熻兘鎻忚堪:IC FPGA 1KB FLASH 600K 144-FBGA RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄e垪锛� 绯诲垪:ProASIC3 妯�(bi膩o)婧�(zh菙n)鍖呰:90 绯诲垪:ProASIC3 LAB/CLB鏁�(sh霉):- 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�:36864 杓稿叆/杓稿嚭鏁�(sh霉):157 闁€鏁�(sh霉):250000 闆绘簮闆诲:1.425 V ~ 1.575 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:-40°C ~ 125°C 灏佽/澶栨:256-LBGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:256-FPBGA锛�17x17锛�
A3P600-2FGG144PP 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:ProASIC3 Flash Family FPGAs