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寤犲晢锛� Microsemi SoC
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鎻忚堪锛� IC FPGA 1KB FLASH 125K 144-TQFP
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绯诲垪锛� ProASIC3
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闁€鏁�(sh霉)锛� 125000
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宸ヤ綔婧害锛� -40°C ~ 85°C
灏佽/澶栨锛� 144-LQFP
渚涙噳鍟嗚ō鍌欏皝瑁濓細 144-TQFP锛�20x20锛�
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ProASIC3 DC and Switching Characteristics
2-10
Revision 13
Power Consumption of Various Internal Resources
Table 2-14 Different Components Contributing to Dynamic Power Consumption in ProASIC3 Devices
Parameter
Definition
Device Specific Dynamic Contributions
(W/MHz)
A
3P100
0
A
3P600
A
3P400
A
3P250
A
3P125
A
3P060
A
3P030
A
3P015
PAC1
Clock contribution of a Global Rib
14.50 12.80 12.80 11.00 11.00 9.30 9.30 9.30
PAC2
Clock contribution of a Global Spine
2.48
1.85
1.35
1.58
0.81
0.81 0.41 0.41
PAC3
Clock contribution of a VersaTile row
0.81
PAC4
Clock contribution of a VersaTile used as a
sequential module
0.12
PAC5
First contribution of a VersaTile used as a
sequential module
0.07
PAC6
Second contribution of a VersaTile used as a
sequential module
0.29
PAC7
Contribution of a VersaTile used as a
combinatorial Module
0.29
PAC8
Average contribution of a routing net
0.70
PAC9
Contribution of an I/O input pin (standard
dependent)
PAC10
Contribution of an I/O output pin (standard
dependent)
PAC11
Average contribution of a RAM block during a
read operation
25.00
PAC12
Average contribution of a RAM block during a
write operation
30.00
PAC13
Dynamic contribution for PLL
2.60
Note: *For a different output load, drive strength, or slew rate, Microsemi recommends using the Microsemi Power
spreadsheet calculator or SmartPower tool in Libero SoC software.
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PDF鎻忚堪
M1A3P250-1FGG144I IC FPGA 1KB FLASH 250K 144-FBGA
M1A3P250-1FG144I IC FPGA 1KB FLASH 250K 144-FBGA
AMC31DREN-S13 CONN EDGECARD 62POS .100 EXTEND
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