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參數(shù)資料
| 型號(hào)： | A1425A-1CQ132C |
| 廠商： | Microsemi SoC |
| 文件頁(yè)數(shù)： | 12/90頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA 2500 GATES 132-CQFP |
| 產(chǎn)品變化通告： | A1425A Family Discontinuation 23/Jan/2012 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | ACT™ 3 |
| LAB/CLB數(shù)： | 310 |
| 輸入/輸出數(shù)： | 100 |
| 門數(shù)： | 2500 |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 132-BCQFP，帶拉桿 |
| 供應(yīng)商設(shè)備封裝： | 132-CQFP（63.5x63.5） |
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Accelerator Series FPGAs – ACT 3 Family
II
Re vis i on 3
Ordering Information
Notes:
1. The –2 and –3 speed grades have been discontinued.
2. The Ceramic Pin Grid Array packages PG100, PG133, and PG175 have been discontinued in all device densities, speed
grades, and temperature grades.
3. The Plastic Ball Grid Array package BG225 has been discontinued in all device densities (specifically for A1460A), all speed
grades, and all temperature grades.
4. Military Grade devices are no longer available for the A1440A device.
5. For more information about discontinued devices, refer to the Product Discontinuation Notices (PDNs) listed below, available on
the Microsemi SoC Products Group website:
_
Part Number
Speed Grade
Package Type
Package Lead Count
C = Commercial (0 to +70°C)
I = Industrial (–40 to +85°C)
M = Military (–55 to +125°C)
B = MIL-STD-883
Application (Temperature Range)
PG = Ceramic Pin Grid Array
PL = Plastic Leaded Chip Carrier
PQ = Plastic Quad Flatpack
RQ = Plastic Power Quad Flatpack
VQ = Very Thin (1.0 mm) Quad Flatpack
TQ = Thin (1.4 mm) Quad Flatpack
CQ = Ceramic Quad Flatpack
BG = Plastic Ball Grid Array
Std = Standard Speed
–1 = Approximately 15% faster than Standard
–2 = Approximately 25% faster than Standard
–3 = Approximately 35% faster than Standard
A1415A = 1,500 Gates
A14V15A = 1,500 Gates (3.3 V)
A1425A = 2,500 Gates
A14V25A = 2,500 Gates (3.3 V)
A1440A = 4,000 Gates
A14V40A = 4,000 Gates (3.3 V)
A1460A = 6,000 Gates
A14V60A = 6,000 Gates (3.3 V)
A14100A = 10,000 Gates
A14V100A = 10,000 Gates (3.3 V)
A14100
1
Die Revision
A = 1.0 mm CMOS Process
A
RQ
208
G
C
Lead-Free Packaging
Blank = Standard Packaging
G = RoHS Compliant Packaging
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| ACC65DRES-S734 | CONN EDGECARD 130PS .100 EYELET |
| ABB106DHNT-S621 | CONN EDGECARD 212PS .050 DIP SLD |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| A1425A-1CQ132M | 制造商:Microsemi Corporation 功能描述:IC FPGA 100 I/O 132CQFP |
| A1425A-1CQ256B | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:HiRel FPGAs |
| A1425A-1CQ256C | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:HiRel FPGAs |
| A1425A-1CQ256E | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:HiRel FPGAs |
| A1425A-1CQ256M | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:HiRel FPGAs |
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