參數(shù)資料
型號(hào): A1422LK
廠商: Allegro Microsystems Inc
文件頁(yè)數(shù): 15/15頁(yè)
文件大小: 1197K
描述: IC SENSOR HALL EFFECT AC 4-SIP
標(biāo)準(zhǔn)包裝: 500
傳感范圍: 35G 跳閘,-35G 釋放
類型: 專用型
電源電壓: 4 V ~ 26.5 V
電流 - 電源: 7mA
電流 - 輸出(最大): 25mA
輸出類型: 數(shù)字,開(kāi)路集電極
特點(diǎn): 高精度
工作溫度: -40°C ~ 150°C
封裝/外殼: 4-SIP
供應(yīng)商設(shè)備封裝: 4-SIP
包裝: 散裝
High Precision Hall Effect AC-Coupled Differential
Sensor IC with Integrated Filter Capacitor
A1421, A1422,
and A1423
15
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Package K, 4-pin SIP
2
4
3
1
E1
E2
2.20  1.50
0.84 REF
1.27 NOM
2.16
MAX
45?/DIV>
45?/DIV>
D
Active Area Depth, .0.42 mm
Hall elements (E1 and E2); not to scale
D
E
E
E
E
B
1.29
Gate and tie bar burr area
A
B
C
Dambar removal protrusion (8X)
A
D
For Reference Only; not for tooling use (reference DWG-9010)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
Standard Branding Reference View
  N = Device part number
  Y = Last two digits of year of manufacture
  W = Week of manufacture
Mold Ejector
Pin Indent
Branded
Face
YYWW
NNNN
1
5.21
+0.08
0.05
0.38
+0.06
0.03
3.43
+0.08
0.05
0.41
+0.07
0.05
14.73 ?.51
1.55 ?.05
Branding scale and appearance at supplier discretion
Copyright ?004-2013, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to
permit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegros products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, LLC assumes no re spon si bil i ty for its
use; nor for any in fringe ment of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
www.allegromicro.com
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