參數(shù)資料
型號: 93AA76C
廠商: Microchip Technology Inc.
英文描述: 8K Microwire Compatible Serial EEPROM
中文描述: 8K的微絲兼容串行EEPROM
文件頁數(shù): 17/28頁
文件大小: 372K
代理商: 93AA76C
2006 Microchip Technology Inc.
DS21796H-page 17
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
B1
B
A1
A
L
A2
p
α
E
eB
β
c
E1
n
D
1
2
Units
INCHES
*
NOM
8
MILLIMETERS
NOM
8
Dimension Limits
MIN
MAX
MIN
MAX
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
*
Controlling Parameter
§
Significant Characteristic
n
p
A
A2
A1
E
E1
D
L
c
B1
B
eB
α
β
.100
.155
.130
2.54
3.94
3.30
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
.170
.145
3.56
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
4.32
3.68
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
§
5
5
5
5
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
相關PDF資料
PDF描述
93AA76B 8K Microwire Compatible Serial EEPROM
93AA76 Serial EEPROM
93AA76P Microwire Serial EEPROM
93AA76SN Microwire Serial EEPROM
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