參數(shù)資料
型號(hào): 935287961118
廠商: NXP SEMICONDUCTORS
元件分類: 網(wǎng)絡(luò)接口
英文描述: DATACOM, INTERFACE CIRCUIT, PDSO8
封裝: 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8
文件頁(yè)數(shù): 3/22頁(yè)
文件大?。?/td> 222K
代理商: 935287961118
2003 Oct 14
11
Philips Semiconductors
Product specication
High speed CAN transceiver
TJA1040
BONDING PAD LOCATIONS
Note
1. All x/y coordinates represent the position of the centre
of each pad (in
m) with respect to the left hand
bottom corner of the top aluminium layer (see Fig.9).
SYMBOL
PAD
COORDINATES(1)
xy
TXD
1
119.5
114.5
GND
2
648.5
85
VCC
3
1214.25
114.5
RXD
4
1635.25
114.5
SPLIT
5
1516.5
1275
CANL
6
990.5
1273.75
CANH
7
530.25
1273.75
STB
8
113.75
1246
handbook, halfpage
MBL584
8
TJA1040U
76
5
1
23
4
y
x
0
test pad 1
test pad 2
Fig.9 Bonding pad locations.
The backside of the bare die must be connected to ground.
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