參數(shù)資料
型號： 935272704551
廠商： NXP SEMICONDUCTORS
元件分類： ADC
英文描述： 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
封裝： 20 X 20 MM, 1.40 MM HEIGHT, PLASTIC, SOT-486-1, LQFP-144
文件頁數(shù)： 50/61頁
文件大?。?/td> 326K
代理商： 935272704551
2004 May 18
54
Philips Semiconductors
Product specication
Triple 8-bit video ADC up to 270 Msps
TDA8754
16.5
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the
“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217
°C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
9. Hot bar or manual soldering is suitable for PMFP packages.
PACKAGE(1)
SOLDERING METHOD
WAVE
REFLOW(2)
BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA,
USON, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN, HVSON, SMS
not suitable(4)
suitable
PLCC(5), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(5)(6)
suitable
SSOP, TSSOP, VSO, VSSOP
not recommended(7)
suitable
CWQCCN..L(8), PMFP(9), WQCCN..L(8)
not suitable
相關(guān)PDF資料
PDF描述
935272703518 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
935273871518 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
935272706518 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
935272703551 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
935272706551 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
935275527134 制造商:NXP Semiconductors 功能描述:IC BUS SWITCH OCTAL QUAD 20TSSOP
935277864112 制造商:NXP Semiconductors 功能描述:IC CPU
935278818112 制造商:NXP Semiconductors 功能描述:LCD DRVR 20DIGIT 2.5V/3.3V/5V 56-Pin VSO Tube
935280517132 制造商:NXP Semiconductors 功能描述:IC TRANSLATING BUFFER 6XSON
935281751112 制造商:NXP Semiconductors 功能描述:IC BUFFER/DVR 16BIT 3ST 48TSSOP
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*