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參數(shù)資料
| 型號： | 935267052005 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, UUC |
| 封裝： | WAFER |
| 文件頁數(shù)： | 2/24頁 |
| 文件大?。?/td> | 341K |
| 代理商： | 935267052005 |
January 2005
Page 10 of 24
Public
6 Bump Specifications
Bump material:
> 99.9% pure Au
Bump hardness:
35 – 80 HV 0.005
Bump shear strength:
> 70 MPa
Bump height:
18 m
Bump height uniformity:
within a die
± 2 m
within a wafer
± 3 m
wafer to wafer
± 4 m
Bump flatness:
± 1.5 m
Bump size
(Bond pad):
LA, LB
144 m x 164 m
Bump size:
(Test pad)
TEST, VSS
104 m x 104 m
(the test pads are electrically neutral at sawn wafers)
Bump size variation:
± 5 m
Under bump metallisation:
sputtered TiW
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