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參數(shù)資料
| 型號： | 935264466005 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, UUC |
| 封裝： | WAFER |
| 文件頁數(shù)： | 19/23頁 |
| 文件大?。?/td> | 337K |
| 代理商： | 935264466005 |
ICODE1 Chip Specification
Rev. 2.2
January 2005
SL040522.doc/B
Public
Page 5 of 23
3 Scope
This specification describes the electrical, physical and dimensional properties of unsawn and sawn
wafers on FFC of ICODE1 Label ICs on a Philips 6C15 IDFW process and is the base for delivery
of tested ICODE1 Label ICs.
General recommendations are given for storage, handling and processing of wafers as well as
assembly of labels.
Reference documents:
MIL-STD 883D Method 3023
MIL-STD 883D Method 3015
SNW-FQ-627
PICTOH-QS007
General Specification for 6” Wafer (Prod. Spec.)
General Quality Specification
ICODE1 Label IC, Coil Design Guide
This product specification is valid for VCOL1V0 from mask revision P/B upwards.
4 Ordering Information
Following ordering options are available:
Type Name
Description
Ordering Code
SL1 ICS30 01W/N5D
Sawn wafer on foil (FFC), 150 m, inked and mapped
9352 644 66005
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