參數(shù)資料
型號(hào)： 935264043025
廠商： NXP SEMICONDUCTORS
元件分類(lèi)： 通信及網(wǎng)絡(luò)
英文描述： SPECIALTY TELECOM CIRCUIT, UUC13
封裝： DIE-13
文件頁(yè)數(shù)： 28/29頁(yè)
文件大小： 236K
代理商： 935264043025
2000 Mar 28
8
Philips Semiconductors
Product specication
Gigabit Ethernet/Fibre Channel
transimpedance amplier
TZA3043; TZA3043B
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
HANDLING
Precautions should be taken to avoid damage through electrostatic discharge. This is particularly important during
assembly and handling of the bare die. Additional safety can be obtained by bonding the VCC and GND pads first, the
remaining pads may then be bonded to their external connections in any order.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VCC
supply voltage
0.5
+6
V
Vn
DC voltage
pin/pad IPhoto
0.5
+1
V
pins/pads OUT and OUTQ
0.5
VCC + 0.5
V
pad AGC (bare die only)
0.5
VCC + 0.5
V
pin/pad DREF
0.5
VCC + 0.5
V
In
DC current
pin/pad IPhoto
2.5
+2.5
mA
pins/pads OUT and OUTQ
15
+15
mA
pad AGC (bare die only)
0.2
+0.2
mA
pin/pad DREF
2.5
+2.5
mA
Ptot
total power dissipation
300
mW
Tstg
storage temperature
65
+150
°C
Tj
junction temperature
150
°C
Tamb
ambient temperature
40
+85
°C
SYMBOL
PARAMETER
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
160
K/W
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