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參數(shù)資料
| 型號： | 935263530112 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通信及網絡 |
| 英文描述： | SPECIALTY TELECOM CIRCUIT, PDSO16 |
| 封裝： | PLASTIC, SOT-403, TSSOP-16 |
| 文件頁數(shù)： | 2/31頁 |
| 文件大小： | 224K |
| 代理商： | 935263530112 |
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1999 Nov 03
10
Philips Semiconductors
Product specication
SDH/SONET STM4/OC12 and
1.25 Gbits/s Gigabit Ethernet postampliers
TZA3044; TZA3044B
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Note
1. For the TZA3044B the minimum value is
0.5 V for ST and STQ outputs.
HANDLING
This device is ESD sensitive and should be handled with care. Precautions should be taken to avoid damage through
electrostatic discharge. This is particularly important during assembly and handling of the bare die. Additional safety can
be obtained by bonding the VCC and GND pads first, the remaining pads may then be bonded to their external
connections in any order.
THERMAL CHARACTERISTICS
Note
1. Thermal resistance from junction to ambient is determined with the IC soldered on a standard single-sided
57
× 57 × 1.6 mm FR4 epoxy printed-circuit board with 35 m thick copper traces. The measurements are performed
in still air.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCC
supply voltage
0.5
+6
V
Vn
DC voltage
pins DIN, DINQ, CF, JAM and RSET
0.5
VCC + 0.5
V
pins ST, STQ, DOUT and DOUTQ
note 1
VCC 2VCC + 0.5
V
pin Vref
0.5
+3.2
V
In
DC current
pins DIN, DINQ, CF and JAM
1+1
mA
pins ST, STQ, DOUT and DOUTQ
25
+10
mA
pin Vref
2
+2.5
mA
pin RSET
2+2
mA
Ptot
total power dissipation
300
mW
Tstg
storage temperature
65
+150
°C
Tj
junction temperature
150
°C
Tamb
ambient temperature
40
+85
°C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
note 1
SO16 package
115
K/W
TSSOP16 package
150
K/W
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