參數(shù)資料
型號(hào): 935263379112
廠商: NXP SEMICONDUCTORS
元件分類: 無(wú)繩電話/電話
英文描述: TELEPHONE SPEECH CKT, PDIP16
封裝: 0.300 INCH, PLASTIC, SOT-38-4, DIP-16
文件頁(yè)數(shù): 14/30頁(yè)
文件大?。?/td> 218K
代理商: 935263379112
2000 Mar 21
21
Philips Semiconductors
Product specication
Low voltage telephone transmission circuit with
dialler interface and regulated strong supply
TEA1114A
BONDING PAD LOCATIONS FOR TEA1114AUH
All x/y coordinates represent the position of the centre of the pad (in
m) with respect to the origin (x/y = 0/0) of the die
(see Fig.18). The size of all pads is 80
m × 80 m.
SYMBOL
PAD
COORDINATES
xy
LN
1
99
365.7
SLPE
2
126
99
REG
3
377
99
IR
4
639
99
AGC
5
869
99
DTMF
6
1162
99
VDD
7
1343
104
MUTE
8
1366
333
QR
9
1366
531
n.c.
10
1366
1010
VEE
11
1370
1160
n.c.
12
1219.5
1160
GAR
13
1045
1160
RX
14
782.5
1160
MIC+
15
357.5
1160
MIC
16
141.5
1160
VCC
17
99
963.5
n.c.
18
99
764
LN
19
99
570
handbook, full pagewidth
DTMF
MUTE
IR
AGC
MICM
MICP
VEE
RX
QR
GAR
VCC
VDD
LN
SLPE
n.c.
REG
n.c.
3
16
4
5
6
15
17
18
19
14
12
13
10
8
9
11
2
7
1
FCA158
x
y
0,0
Fig.18 TEA1114AUH bonding pad locations.
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