- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄36336 > 935260566151 (NXP SEMICONDUCTORS) COLOR SIGNAL ENCODER, PQFP44 PDF資料下載
參數(shù)資料
| 型號： | 935260566151 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 顏色信號轉(zhuǎn)換 |
| 英文描述： | COLOR SIGNAL ENCODER, PQFP44 |
| 封裝： | PLASTIC, SOT-307, QFP-44 |
| 文件頁數(shù)： | 48/59頁 |
| 文件大?。?/td> | 232K |
| 代理商： | 935260566151 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁當(dāng)前第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁
2000 Mar 08
52
Philips Semiconductors
Product specication
Digital video encoder
SAA7128H; SAA7129H
11.5
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
BGA, SQFP
not suitable
suitable
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not suitable(2)
suitable
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 935260566157 | COLOR SIGNAL ENCODER, PQFP44 |
| 935260567118 | COLOR SIGNAL ENCODER, PQFP44 |
| 935260567151 | COLOR SIGNAL ENCODER, PQFP44 |
| 935260567157 | COLOR SIGNAL ENCODER, PQFP44 |
| 935262600518 | COLOR SIGNAL ENCODER, PQFP44 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 935261069122 | 制造商:NXP Semiconductors 功能描述:IC SECURITY TRANSPONDER PLLMC |
| 935262025112 | 制造商:NXP Semiconductors 功能描述:SUB ONLY IC |
| 935262217118 | 制造商:NXP Semiconductors 功能描述:Real Time Clock Serial 8-Pin SO T/R |
| 935264217557 | 制造商:NXP Semiconductors 功能描述:SUB ONLY IC |
| 935267356112 | 制造商:NXP Semiconductors 功能描述:IC TEA1507PN |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。