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參數(shù)資料
| 型號(hào)： | 935260219122 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類(lèi)： | 通信及網(wǎng)絡(luò) |
| 英文描述： | SPECIALTY TELECOM CIRCUIT, XMA |
| 封裝： | 11.75 X 7.55 MM, 0.45 MM HEIGHT, MODULE |
| 文件頁(yè)數(shù)： | 2/22頁(yè) |
| 文件大?。?/td> | 161K |
| 代理商： | 935260219122 |
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Specifications of the HT2 MOA3 S20
Rev. 1.1
1997-08-19
Ht2moa3.doc/HS
Page 10 of 22
4 Coil Specifications
The HITAG 2 chip module has to be connected to a coil whose parameters are briefly described
in the following.
Equivalent circuit of the transponder
Xpc
Rpc
Cp
Uc
Cchip
Rchip
Uc
...
voltage at the connection pads
fres
...
resonant frequency of the transponder
Xpc
...
parallel reactance of the coil (f = 125 kHz)
Rpc
...
parallel resistance of the coil (f = 125 kHz)
Cp
...
parasitic capacitance of the package
Cchip
...
capacitance of the chip (Uc > 4 Vpp)
Rchip
...
resistance of the chip
fresc
...
self resonant frequency of the coil
Lpc
=
Xpc/2
πf (f = 125 kHz)
Lpc
=
7.72 mH
± x % (C
p = 0, x depends on the coil production process)
Cchip
=
210 pF ± 10 %
Rpc
>
45 k
[
fresc
>
750 kHz
Note: The parasitic capacitance of the package (Cp) must be considered.
()
f
1
2(C
C ).L
125 kHz
L
=
1
2f
C
+ C
res
chip
p
pc
res
chip
p
=
+
=
π
2
Typical values for Cp
hot laminated cards:
Cp = 1.5 pF
moulded tags:
Cp = 6.0 pF
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