參數(shù)資料
型號(hào)： 935064190005
廠商： NXP SEMICONDUCTORS
元件分類： 顯示驅(qū)動(dòng)器
英文描述： LIQUID CRYSTAL DISPLAY DRIVER, U
封裝： DIE
文件頁數(shù)： 35/44頁
文件大小： 192K
代理商： 935064190005
2001 Oct 02
40
Philips Semiconductors
Product specication
Universal LCD driver for low multiplex rates
PCF8576
17.5
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
BGA, HBGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
not suitable(2)
suitable
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
相關(guān)PDF資料
PDF描述
0560-6600-01 HDSL & MDSL MAGNETICS For Conexant Bt8960 and Bt8970
0560-6600-02 HDSL & MDSL MAGNETICS For Conexant Bt8960 and Bt8970
0560-6600-03 HDSL & MDSL MAGNETICS For Conexant Bt8960 and Bt8970
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