
INTERCONNECTS
.050” Grid
Single and Double Row
www.mill-max.com
516-922-6000
70
Series 850, 851
852, 853
SPECIFY PLATING CODE XX=
9 3
9 9
Sleeve (Pin)
Contact (Clip)
200
” Sn/Pb 200”Sn/Pb
30
” Au
200
”Sn/Pb
Fig. 1
Fig. 2
(Number of Pins
X .050”) + .040”
Ordering Information
Single Row
.087” Profile Pin Header
850-XX-0_ _-10-001
Double Row
.075” Profile Pin Header
852-XX-_ _ _-10-001
Single Row
.161” Profile Socket
851-XX-0_ _-10-001
Double Row
.161” Profile Socket
853-XX-_ _ _-10-001
Single Row
.185” Profile Socket
851-XX-0_ _-10-002
Fig. 3
Fig. 4
Fig. 5
Specify # of pins
01-50
Specify # of pins
002-100
Specify # of pins
01-50
Specify # of pins
002-100
Specify # of pins
01-77
SPECIFY PLATING CODE XX=
1 0
9 0
Pin Plating
10
” Au
200
” Sn/Pb
Fig. 1
Fig. 2
Fig. 4
Fig. 5
Fig. 3
Series 850 single and double row
interconnects have .050” pin
spacing and permit board stacking
as low as .248”.
Pin headers have .017” dia. pins.
(MM# 3006 see page 166 for details).
MM# 0489 and 0467 receptacles
use M-M#11 Hi-Rel, 3-finger beryl-
lium copper contacts rated at 3 amps.
(#11 contact accepts pin diameters
from .015-.020)
Insulators are high temp. thermo-
plastic, suitable for all soldering
operations.
XX= Plating Code
See Below
XX= Plating Code
See Below