SCOPE: MONOLITHIC CMOS, ANALOG MULTIPLEXER
Device Type
Generic Number
SMD Number
01
DG508AA(x)/883B
7705201
Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:
Outline Letter
Mil-Std-1835
Case Outline
Package Code
MAXIM
SMD
K
E
GDIP1-T16 or CDIP2-T16
16 LEAD CERDIP
J16
L
X
CDFP4-16
16 LEAD FLATPACK
F16
P
E
GDIP1-T16 or CDIP2-T16
16 LEAD Sidebraze
P16
Z
2
CQCC1-N20
20-Pin Ceramic LCC
L20
Absolute Maximum Ratings
Voltage Referenced to V
-
V
+ to V- .............................................................................................................................. 44V
V
+ to GND ........................................................................................................................ +22V
V
- to GND .......................................................................................................................... -22V
Digital Inputs, VS or VD 1/.......................................................................... (V
-) -3.0V to (V+)
Analog Inputs Voltage ........................................................................... (V
-) -2.0V to (V+)+2V
Analog Input, Overvoltage Range ............................................................... (V
-) -3.0V to (V+)
Lead Temperature (soldering, 10 seconds) ............................................................................ +300
°C
Storage Temperature .............................................................................................. -65
°C to +150°C
Continuous Power Dissipation ............................................................................. TA=+70°C
16 lead FLATPACK (derate 6.1mW/
°C above +70°C) ............................................. 485mW
16 lead CERDIP(derate 10.0mW/
°C above +70°C) .................................................. 800mW
16 lead Side Braze(derate 10.5mW/
°C above +70°C) ............................................... 842mW
20 lead LCC (derate 9.1mW/
°C above +70°C) ......................................................... 727mW
Junction Temperature TJ .....................................................................................….. +150°C
Thermal Resistance, Junction to Case,
ΘJC:
Case Outline 16 lead FLATPACK ............................................................ 65
°C/W
Case Outline 16 lead CERDIP................................................................... 50
°C/W
Case Outline 16 lead Side Braze................................................................ 45
°C/W
Case Outline 20 lead LCC ........................................................................ 20
°C/W
Thermal Resistance, Junction to Ambient,
ΘJA:
Case Outline 16 lead FLATPACK ........................................................... 165
°C/W
Case Outline 16 lead CERDIP.................................................................. 100
°C/W
Case Outline 16 lead Side Braze................................................................. 95
°C/W
Case Outline 20 lead LCC ....................................................................... 110
°C/W
Recommended Operating Conditions.
Ambient Operating Range (TA) ............................................................... -55°C to +125°C
NOTE 1: Signals on S, D, IN exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current
to maximum current ratings.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
----------------------------
Electrical Characteristics of DG508A/883B
19-0339
Rev. B
for SMD 7705201
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