參數(shù)資料
型號: 74LVTH574WMX
廠商: Fairchild Semiconductor
文件頁數(shù): 1/11頁
文件大?。?/td> 0K
描述: IC FLIP FLOP OCT D 3ST 20SOIC
標準包裝: 1,000
系列: 74LVTH
功能: 標準
類型: D 型總線
輸出類型: 三態(tài)非反相
元件數(shù): 1
每個元件的位元數(shù): 8
頻率 - 時鐘: 150MHz
延遲時間 - 傳輸: 4.5ns
觸發(fā)器類型: 正邊沿
輸出電流高,低: 32mA,64mA
電源電壓: 2.7 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
包裝: 帶卷 (TR)
74L
VT574,
74L
VTH574
Lo
w
V
olta
g
e
Octal
D-T
ype
Flip-Flop
with
3-ST
A
TE
Outputs
1999 Fairchild Semiconductor Corporation
www.fairchildsemi.com
74LVT574, 74LVTH574 Rev. 1.6.0
January 2008
74LVT574, 74LVTH574
Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
Features
Input and output interface capability to systems at
5V VCC
Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH574),
also available without bushold feature (74LVT574)
Live insertion/extraction permitted
Power Up/Down high impedance provides glitch-free
bus loading
Outputs source/sink –32mA/+64mA
Functionally compatible with the 74 series 574
Latch-up performance exceeds 500mA
ESD performance:
– Human-body model
> 2000V
– Machine model
> 200V
– Charged-device model
> 1000V
General Description
The LVT574 and LVTH574 are high-speed, low-power
octal D-type flip-flop featuring separate D-type inputs for
each flip-flop and 3-STATE outputs for bus-oriented
applications. A buffered Clock (CP) and Output Enable
(OE) are common to all flip-flops.
The LVTH574 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These octal flip-flops are designed for low-voltage (3.3V)
VCC applications, but with the capability to provide a TTL
interface to a 5V environment. The LVT574 and
LVTH574 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining a low power dissipation.
Ordering Information
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
Order Number
Package
Number
Package Description
74LVT574WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LVT574SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVT574MSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LVT574MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
74LVTH574WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LVTH574SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVTH574MSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LVTH574MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
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