參數(shù)資料
型號(hào): 74LVCH16541A
廠商: NXP Semiconductors N.V.
元件分類: 通用總線功能
英文描述: 14-Bit Asynchronous Binary Counters 16-SOIC -40 to 85
中文描述: 16位緩沖器/線路驅(qū)動(dòng)器三態(tài)
文件頁(yè)數(shù): 4/10頁(yè)
文件大小: 83K
代理商: 74LVCH16541A
Philips Semiconductors
Product specification
74LVCH16541A
16-bit buffer/line driver; 5V tolerant I/O (3-State)
1998 May 19
4
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CC
DC supply voltage
(for maximum speed performance)
2.7
3.6
V
DC supply voltage
(for low-voltage applications)
1.2
3.6
V
I
DC Input voltage range
For data input pins with
bus hold
0
V
CC
V
For data input pins without
bus hold
0
5.5
V
DC output voltage range;
output HIGH or LOW state
0
V
CC
V
O
DC output voltage range; output 3-State
0
5.5
T
amb
Operating ambient temperature range
in free air
–40
+85
°
C
t
r
, t
f
Input rise and fall times
V
CC
= 1.2 to 2.7V
V
CC
= 2.7 to 3.6V
0
0
20
10
ns/V
ABSOLUTE MAXIMUM VALUES
1, 2
In accordance with the Absolute Maximum Rating System (IEC 134) Voltages are referenced to GND (ground = 0V)
SYMBOL
PARAMETER
CONDITIONS
MIN
MAX
UNIT
V
CC
DC supply voltage
–0.5
+6.5
V
I
IK
DC input diode current
V
I
< 0
–50
mA
V
I
DC input voltage
Note 3
–0.5
+6.5
V
I
OK
DC output diode current
V
O
> V
CC
or V
O
< 0
50
mA
V
DC output voltage; output HIGH or LOW
state
Note 3
–0.5
V
CC
+ 0.5
V
O
DC output voltage; output 3-State
–0.5
6.5
I
O
DC output source or sink current
V
O
= 0 to V
CC
50
mA
I
GND
, I
CC
DC V
CC
or GND current
100
mA
T
stg
Storage temperature range
–65
+150
°
C
Power dissipation per package
– SSOP (plastic medium-shrink)
– TSSOP (plastic thin-medium-shrink)
For temperature range: –40 to +125
°
C
above +70
°
C derate linearly 8mW/K
above +60
°
C derate linearly 5.5mW/K
P
tot
500
500
mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150
°
C.
3. The input and output voltage ratings may be exceeded if the input and output clamp current ratings are observed.
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