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參數(shù)資料
| 型號(hào)： | 74LVC4245A |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 模擬專用變換器 |
| 英文描述： | 3-state，Octal dual supply translating transceiver |
| 中文描述： | 3態(tài)，八路雙電源轉(zhuǎn)換收發(fā)器 |
| 文件頁數(shù)： | 13/16頁 |
| 文件大?。?/td> | 90K |
| 代理商： | 74LVC4245A |
1999 Jun 15
13
Philips Semiconductors
Product specification
Octal dual supply translating transceiver; 3-state
74LVC4245A
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 74LVC4245ABQ | 制造商:NXP Semiconductors 功能描述:IC OCTAL TXRX TRI-ST DHVQF |
| 74LVC4245ABQ,115 | 功能描述:總線收發(fā)器 3.3V OCT DUAL XLATING XCEIVER RoHS:否 制造商:Fairchild Semiconductor 邏輯類型:CMOS 邏輯系列:74VCX 每芯片的通道數(shù)量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時(shí)間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel |
| 74LVC4245ABQ,118 | 功能描述:總線收發(fā)器 Bus XCVR Single 8-CH 3-ST 24-Pin RoHS:否 制造商:Fairchild Semiconductor 邏輯類型:CMOS 邏輯系列:74VCX 每芯片的通道數(shù)量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時(shí)間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel |
| 74LVC4245ABQ-G | 功能描述:總線收發(fā)器 3.3V OCT DUAL XLATING XCEIVER RoHS:否 制造商:Fairchild Semiconductor 邏輯類型:CMOS 邏輯系列:74VCX 每芯片的通道數(shù)量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時(shí)間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel |
| 74LVC4245ABQ-Q100J | 功能描述:Voltage Level Translator Bidirectional 1 Circuit 8 Channel 24-DHVQFN (5.5x3.5) 制造商:nxp semiconductors 系列:汽車級(jí)，AEC-Q100，74LVC 包裝:帶卷（TR） 零件狀態(tài):有效 轉(zhuǎn)換器類型:電壓電平 通道類型:雙向 電路數(shù):1 每個(gè)電路的通道數(shù):8 電壓 - VCCA:1.5 V ~ 5.5 V 電壓?- VCCB:1.5 V ~ 3.6 V 輸入信號(hào):- 輸出信號(hào):- 輸出類型:三態(tài)，非反相 數(shù)據(jù)速率:- 工作溫度:-40°C ~ 125°C（TA） 特性:- 安裝類型:表面貼裝 封裝/外殼:24-VFQFN 裸露焊盤 供應(yīng)商器件封裝:24-DHVQFN（5.5x3.5） 標(biāo)準(zhǔn)包裝:3,000 |
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