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參數(shù)資料
| 型號(hào)： | 74HCT4059 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 通用總線功能 |
| 英文描述： | Programmable divide-by-n counter |
| 中文描述： | 可編程分頻氮計(jì)數(shù)器 |
| 文件頁數(shù)： | 19/20頁 |
| 文件大?。?/td> | 147K |
| 代理商： | 74HCT4059 |
1998 Jul 08
19
Philips Semiconductors
Product specification
Programmable divide-by-n counter
74HC/HCT4059
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
DIP
S
OLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
°
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
°
C, contact may be up to 5 seconds.
SO
R
EFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
°
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
°
C.
W
AVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
°
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
°
C within
6 seconds. Typical dwell time is 4 seconds at 250
°
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
°
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
°
C.
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| 74HCT4059D | 功能描述:計(jì)數(shù)器移位寄存器 PROGRMBL DIVIDE-BY-N COUNTER RoHS:否 制造商:Texas Instruments 計(jì)數(shù)器類型: 計(jì)數(shù)順序:Serial to Serial/Parallel 電路數(shù)量:1 封裝 / 箱體:SOIC-20 Wide 邏輯系列: 邏輯類型: 輸入線路數(shù)量:1 輸出類型:Open Drain 傳播延遲時(shí)間:650 ns 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 封裝:Reel |
| 74HCT4059D,112 | 功能描述:計(jì)數(shù)器 IC PROGRMBL DIVIDE-BY-N RoHS:否 制造商:NXP Semiconductors 計(jì)數(shù)器類型:Binary Counters 邏輯系列:74LV 位數(shù):10 計(jì)數(shù)法: 計(jì)數(shù)順序: 工作電源電壓:1 V to 5.5 V 工作溫度范圍:- 40 C to + 125 C 封裝 / 箱體:SOT-109 封裝:Reel |
| 74HCT4059D,118 | 功能描述:計(jì)數(shù)器移位寄存器 PROGRMBL DIVIDE-BY-N RoHS:否 制造商:Texas Instruments 計(jì)數(shù)器類型: 計(jì)數(shù)順序:Serial to Serial/Parallel 電路數(shù)量:1 封裝 / 箱體:SOIC-20 Wide 邏輯系列: 邏輯類型: 輸入線路數(shù)量:1 輸出類型:Open Drain 傳播延遲時(shí)間:650 ns 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 封裝:Reel |
| 74HCT4059D-T | 功能描述:計(jì)數(shù)器 IC PROGRMBL DIVIDE-BY-N COUNTER RoHS:否 制造商:NXP Semiconductors 計(jì)數(shù)器類型:Binary Counters 邏輯系列:74LV 位數(shù):10 計(jì)數(shù)法: 計(jì)數(shù)順序: 工作電源電壓:1 V to 5.5 V 工作溫度范圍:- 40 C to + 125 C 封裝 / 箱體:SOT-109 封裝:Reel |
| 74HCT4059N,112 | 功能描述:計(jì)數(shù)器 IC COUNTR PROG DIV-BY-N DIV X N RoHS:否 制造商:NXP Semiconductors 計(jì)數(shù)器類型:Binary Counters 邏輯系列:74LV 位數(shù):10 計(jì)數(shù)法: 計(jì)數(shù)順序: 工作電源電壓:1 V to 5.5 V 工作溫度范圍:- 40 C to + 125 C 封裝 / 箱體:SOT-109 封裝:Reel |
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