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參數(shù)資料
| 型號(hào)： | 74F862 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Bus transceivers (3-State)(總線收發(fā)器（三態(tài)）) |
| 中文描述： | 總線收發(fā)器（3態(tài)）（總線收發(fā)器（三態(tài)）） |
| 文件頁數(shù)： | 6/12頁 |
| 文件大小： | 89K |
| 代理商： | 74F862 |
Philips Semiconductors
Product specification
74F862, 74F863
Bus transceivers (3-State)
2000 Mar 24
6
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST CONDITIONS
1
LIMITS
UNIT
MIN
TYP
2
MAX
V
CC
= MIN,
V
IL
= MAX,
V
IH
= MIN
= 1 mA
I
OH
= –1 mA
±
10%V
CC
2.4
V
V
OH
High level output voltage
High-level output voltage
±
5%V
CC
2.4
3.3
V
V
CC
= MIN,
V
IL
= MAX,
V
IH
= MIN
= 24 mA
I
OH
= –24 mA
±
10%V
CC
2.0
V
±
5%V
CC
2.0
V
V
OL
Low level output voltage
Low-level output voltage
V
CC
= MIN,
V
IL
= MAX,
V
IH
= MIN
I
OL
= –48 mA
±
10%V
CC
0.38
0.55
V
I
OL
= 64 mA
±
5%V
CC
0.42
0.55
V
V
IK
Input clamp voltage
V
CC
= MIN, I
I
= I
IK
–0.73
–1.2
V
I
Input current at
maximum input voltage
OEAB, OEBA
OEAB
n
, OEBA
n
V
CC
= 0.0 V, V
I
= 7.0 V
100
μ
A
I
A
n
, B
n
V
CC
= 5.5 V, V
I
= 5.5 V
1
mA
I
IH
High-level input current
V
CC
= MAX, V
I
= 2.7 V
20
μ
A
I
IL
Low-level input current
V
CC
= MAX, V
I
= 0.5 V
–20
μ
A
I
IH
+ I
OZH
Off-state output current
High-level voltage applied
A
n
, B
n
V
CC
= MAX, V
O
= 2.7 V
70
μ
A
I
IL
+ I
OZL
Off-state output current
Low-level voltage applied
V
CC
= MAX, V
O
= 0.5 V
–70
μ
A
I
OS
Short-circuit output current
3
V
CC
= MAX
–100
–225
mA
I
CCH
145
195
mA
A
n
, B
n
74F863
I
CCL
V
CC
= MAX
140
195
mA
I
CCZ
165
220
mA
I
CC
Supply current total
I
CCH
90
130
mA
74F862
I
CCL
V
CC
= MAX
120
170
mA
I
CCZ
130
160
mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
CC
= 5 V, T
a
= 25
°
C.
3. Not more than one output should be shorted at a time. For testing I
OS
, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
OS
tests should be performed last.
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