Philips Semiconductors
Product specification
74F521
8-bit identity comparator
May 15, 1990
4
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limits set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.)
SYMBOL
PARAMETER
RATING
UNIT
V
CC
Supply voltage
–0.5 to +7.0
V
V
IN
Input voltage
–0.5 to +7.0
V
I
IN
Input current
–30 to +5
mA
V
OUT
Voltage applied to output in High output state
–0.5 to V
CC
V
I
OUT
Current applied to output in Low output state
40
mA
T
amb
Operating free-air temperature range
0 to +70
°
C
T
stg
Storage temperature range
–65 to +150
°
C
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
LIMITS
UNIT
MIN
NOM
MAX
V
CC
Supply voltage
4.5
5.0
5.5
V
V
IH
High-level input voltage
2.0
V
V
IL
Low-level input voltage
0.8
V
I
IK
Input clamp current
–18
mA
I
OH
High-level output current
–1
mA
I
OL
Low-level output current
20
mA
T
amb
Operating free-air temperature range
0
+70
°
C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST CONDITIONS
1
LIMITS
TYP
2
UNIT
MIN
MAX
V
OH
High level output voltage
High-level output voltage
V
CC
= MIN, V
IL
= MAX
±
10%V
CC
2.5
V
V
IH
= MIN, I
OH
= MAX
±
5%V
CC
2.7
3.4
V
OL
Low level output voltage
Low-level output voltage
V
CC
= MIN, V
IL
= MAX
±
10%V
CC
0.30
0.50
V
V
IH
= MIN, I
OL
= MAX
±
5%V
CC
0.30
0.50
V
IK
I
I
Input clamp voltage
V
CC
= MIN, I
I
= I
IK
V
CC
= MAX, V
I
= 7.0V
–0.73
–1.2
V
Input current at maximum input voltage
100
μ
A
I
IH
High-level input current
V
CC
= MAX, V
I
= 2.7V
20
μ
A
I
IL
Low-level input current
V
CC
= MAX, V
I
= 0.5V
–0.6
mA
I
OS
Short-circuit output current
3
V
CC
= MAX
–60
–150
mA
I
CC
Supply current (total)
I
CCH
V
CC
= MAX
24
36
mA
I
CCL
24
36
mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
= 5V, T
= 25
°
C.
3. Not more than one output should be shorted at a time. For testing I
, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
OS
tests should be performed last.